| 11424728 |
Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process |
Dae Ho Kim, Mary Winters, Jeffrey B. Shealy |
2022-08-23 |
|
| 7353590 |
Method of forming printed circuit card |
Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more |
2008-04-08 |
$6,866,000 |
| 6986198 |
Method of forming printed circuit card |
Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more |
2006-01-17 |
$9,394,000 |
| 6924866 |
Method of constructing a liquid crystal display element that includes dispensing an optical grade adhesive to fill vias in a transparent substrate |
Charles F. Scaglione |
2005-08-02 |
$2,895,000 |
| 6759738 |
Systems interconnected by bumps of joining material |
Christian Robert Le Coz, Mark V. Pierson |
2004-07-06 |
$6,814,000 |
| 6750405 |
Two signal one power plane circuit board |
Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more |
2004-06-15 |
$11,083,000 |
| 6674506 |
Apparatus for introducing a fluid into vias formed in a liquid crystal display element |
Charles F. Scaglione |
2004-01-06 |
$3,537,000 |
| 6619334 |
Method of delivering fluid into constricted openings free of voids |
Charles F. Scaglione |
2003-09-16 |
$2,699,000 |
| 6476902 |
Liquid crystal display and method of making same |
Charles F. Scaglione |
2002-11-05 |
$2,794,000 |
| 6344234 |
Method for forming reflowed solder ball with low melting point metal cap |
Hormazdyar M. Dalal, Alexis Bitaillou, Gene J. Gaudenzi, Kenneth Robert Herman, Frederic Pierre +1 more |
2002-02-05 |
$11,026,000 |
| 6259159 |
Reflowed solder ball with low melting point metal cap |
Hormazdyar M. Dalal, Alexis Bitaillou, Gene Jospeh Gaudenzi, Kenneth Robert Herman, Frederic Pierre +1 more |
2001-07-10 |
$19,901,000 |
| 6204453 |
Two signal one power plane circuit board |
Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more |
2001-03-20 |
$35,881,000 |
| 5923090 |
Microelectronic package and fabrication thereof |
William H. Ma |
1999-07-13 |
$29,937,000 |
| 5872051 |
Process for transferring material to semiconductor chip conductive pads using a transfer substrate |
Christian Robert Le Coz, Mark V. Pierson |
1999-02-16 |
$10,802,000 |
| 5798285 |
Method of making electronic module with multiple solder dams in soldermask window |
Mark Rudolf Bentlage, Lawrence H. White |
1998-08-25 |
$17,258,000 |
| 5796591 |
Direct chip attach circuit card |
Hormazdyar M. Dalal |
1998-08-18 |
$11,146,000 |
| 5729896 |
Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder |
Hormazdyar M. Dalal, Gene J. Gaudenzi, Cynthia S. Milkovich |
1998-03-24 |
$15,296,000 |
| 5672260 |
Process for selective application of solder to circuit packages |
Charles F. Carey, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak, Richard Stuart Zarr |
1997-09-30 |
$18,961,000 |
| 5656139 |
Electroplating apparatus |
Charles F. Carey, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak, Richard Stuart Zarr |
1997-08-12 |
$28,856,000 |
| 5650595 |
Electronic module with multiple solder dams in soldermask window |
Mark Rudolf Bentlage, Lawrence H. White |
1997-07-22 |
$26,919,000 |
| 5634268 |
Method for making direct chip attach circuit card |
Hormazdyar M. Dalal, Gene J. Gaudenzi |
1997-06-03 |
$12,468,000 |
| 5597469 |
Process for selective application of solder to circuit packages |
Charles F. Carey, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak, Richard Stuart Zarr |
1997-01-28 |
$23,855,000 |
| 5542601 |
Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate |
Miguel A. Jimarez, Joseph Edward Zdimal |
1996-08-06 |
$6,901,000 |
| 5075965 |
Low temperature controlled collapse chip attach process |
Charles F. Carey, Rochelle Ginsburg, Charles G. Woychik |
1991-12-31 |
$27,237,000 |
