Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424728 | Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer process | Dae Ho Kim, Mary Winters, Jeffrey B. Shealy | 2022-08-23 |
| 7353590 | Method of forming printed circuit card | Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more | 2008-04-08 |
| 6986198 | Method of forming printed circuit card | Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more | 2006-01-17 |
| 6924866 | Method of constructing a liquid crystal display element that includes dispensing an optical grade adhesive to fill vias in a transparent substrate | Charles F. Scaglione | 2005-08-02 |
| 6759738 | Systems interconnected by bumps of joining material | Christian Robert Le Coz, Mark V. Pierson | 2004-07-06 |
| 6750405 | Two signal one power plane circuit board | Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more | 2004-06-15 |
| 6674506 | Apparatus for introducing a fluid into vias formed in a liquid crystal display element | Charles F. Scaglione | 2004-01-06 |
| 6619334 | Method of delivering fluid into constricted openings free of voids | Charles F. Scaglione | 2003-09-16 |
| 6476902 | Liquid crystal display and method of making same | Charles F. Scaglione | 2002-11-05 |
| 6344234 | Method for forming reflowed solder ball with low melting point metal cap | Hormazdyar M. Dalal, Alexis Bitaillou, Gene J. Gaudenzi, Kenneth Robert Herman, Frederic Pierre +1 more | 2002-02-05 |
| 6259159 | Reflowed solder ball with low melting point metal cap | Hormazdyar M. Dalal, Alexis Bitaillou, Gene Jospeh Gaudenzi, Kenneth Robert Herman, Frederic Pierre +1 more | 2001-07-10 |
| 6204453 | Two signal one power plane circuit board | Miguel A. Jimarez, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more | 2001-03-20 |
| 5923090 | Microelectronic package and fabrication thereof | William H. Ma | 1999-07-13 |
| 5872051 | Process for transferring material to semiconductor chip conductive pads using a transfer substrate | Christian Robert Le Coz, Mark V. Pierson | 1999-02-16 |
| 5798285 | Method of making electronic module with multiple solder dams in soldermask window | Mark Rudolf Bentlage, Lawrence H. White | 1998-08-25 |
| 5796591 | Direct chip attach circuit card | Hormazdyar M. Dalal | 1998-08-18 |
| 5729896 | Method for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solder | Hormazdyar M. Dalal, Gene J. Gaudenzi, Cynthia S. Milkovich | 1998-03-24 |
| 5672260 | Process for selective application of solder to circuit packages | Charles F. Carey, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak, Richard Stuart Zarr | 1997-09-30 |
| 5656139 | Electroplating apparatus | Charles F. Carey, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak, Richard Stuart Zarr | 1997-08-12 |
| 5650595 | Electronic module with multiple solder dams in soldermask window | Mark Rudolf Bentlage, Lawrence H. White | 1997-07-22 |
| 5634268 | Method for making direct chip attach circuit card | Hormazdyar M. Dalal, Gene J. Gaudenzi | 1997-06-03 |
| 5597469 | Process for selective application of solder to circuit packages | Charles F. Carey, Voya R. Markovich, Douglas O. Powell, Gary Paul Vlasak, Richard Stuart Zarr | 1997-01-28 |
| 5542601 | Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate | Miguel A. Jimarez, Joseph Edward Zdimal | 1996-08-06 |
| 5075965 | Low temperature controlled collapse chip attach process | Charles F. Carey, Rochelle Ginsburg, Charles G. Woychik | 1991-12-31 |