Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6223968 | Solder bonding/debonding nozzle insert | Charles Felix Gabriel, Miguel A. Jimarez | 2001-05-01 |
| 6082608 | Solder bonding/debonding nozzle insert | Charles Felix Gabriel, Miguel A. Jimarez | 2000-07-04 |
| 5810241 | Solder bonding/debonding nozzle insert | Charles Felix Gabriel, Miguel A. Jimarez | 1998-09-22 |
| 5542601 | Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate | Kenneth Michael Fallon, Miguel A. Jimarez | 1996-08-06 |