JB

John Blondin

IBM: 5 patents #18,733 of 70,183Top 30%
EC Emc Ip Holding Company: 3 patents #1,358 of 4,608Top 30%
Overall (All Time): #641,690 of 4,157,543Top 20%
8
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9854690 3U “T” shaped chassis design with rail features Gordon A. Frye, Ralph C. Frangioso, Jr., Robert P. Wierzbicki, Keith C. Johnson 2017-12-26
9801279 Configurable system board Ralph C. Frangioso, Jr., Joseph P. King, Jr., Stephen E. Strickland, David C. Bisbee 2017-10-24
9545006 Configurable system board Ralph C. Frangioso, Jr., Joseph P. King, Jr., Stephen E. Strickland, David C. Bisbee 2017-01-10
7026806 Apparatus for preventing cross talk and interference in semiconductor devices during test Gene T. Patrick, Kevin M. Potasiewicz 2006-04-11
6921288 Semiconductor test and burn-in apparatus provided with a high current power connector for combining power planes Gene T. Patrick 2005-07-26
6176374 Component carrier having a wave pattern tension reduction surface Jeffrey Jay Jones, David J. Rich, Woody Smith 2001-01-23
6171873 Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information Ronald L. Mendelson, Robert F. Cook, David Frederick Diefenderfer, Eric G. Liniger, Donald W. Brouillette 2001-01-09
5888838 Method and apparatus for preventing chip breakage during semiconductor manufacturing using wafer grinding striation information Ronald L. Mendelson, Robert F. Cook, David Frederick Diefenderfer, Eric G. Liniger, Donald W. Brouillette 1999-03-30