Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10390460 | Apparatus and methods for cooling of an integrated circuit | Simon Jasmin | 2019-08-20 |
| 10134704 | Thermocompression for semiconductor chip assembly | — | 2018-11-20 |
| 9761542 | Liquid metal flip chip devices | ASSANE NDIEGUENE, Pierre Albert | 2017-09-12 |
| 9735125 | Thermocompression for semiconductor chip assembly | — | 2017-08-15 |
| 9698072 | Low-stress dual underfill packaging | Peter J. Brofman, Marie-Claude Paquet | 2017-07-04 |
| 9373559 | Low-stress dual underfill packaging | Peter J. Brofman, Marie-Claude Paquet | 2016-06-21 |
| 9287230 | Thermocompression for semiconductor chip assembly | — | 2016-03-15 |
| 8939346 | Methods and systems involving soldering | — | 2015-01-27 |
| 8932909 | Thermocompression for semiconductor chip assembly | — | 2015-01-13 |
| 8910853 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more | 2014-12-16 |
| 8796049 | Underfill adhesion measurements at a microscopic scale | Maxime Cadotte, Marie-Claude Paquet | 2014-08-05 |
| 8493746 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more | 2013-07-23 |
| 8197612 | Optimization of metallurgical properties of a solder joint | James A. Busby, Minhua Lu, Valerie Oberson, Eric D. Perfecto, Kamalesh K. Srivastava +2 more | 2012-06-12 |
| 7538432 | Temporary structure to reduce stress and warpage in a flip chip organic package | David Danovitch | 2009-05-26 |
| 7512518 | Method for measuring thin layers in solid state devices | Alexandre Blander, Richard Brassard, Carl Savard | 2009-03-31 |
| 7498198 | Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties | Sylvie Charles, David Danovitch, Sylvain Ouimet | 2009-03-03 |
| 7482180 | Method for determining the impact of layer thicknesses on laminate warpage | Jean Audet, Marco Gauvin, Sylvain Pharand | 2009-01-27 |
| 7484190 | Method to optimize the manufacturing of interconnects in microelectronic packages | Eric Duchesne | 2009-01-27 |
| 7473618 | Temporary structure to reduce stress and warpage in a flip chip organic package | David Danovitch | 2009-01-06 |