TG

Terence C. Godown

IBM: 1 patents #44,794 of 70,183Top 65%
📍 Endwell, NY: #174 of 267 inventorsTop 70%
🗺 New York: #67,335 of 115,490 inventorsTop 60%
Overall (All Time): #3,849,352 of 4,157,543Top 95%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5109318 Pluggable electronic circuit package assembly with snap together heat sink housing Joseph Funari, Scott Reynolds, Bahgat Sammakia 1992-04-28