Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363865 | Regenerative preheater for phase change cooling applications | Sadegh Khalili | 2025-07-15 |
| 11876036 | Fluid cooling system including embedded channels and cold plates | Leila Choobineh | 2024-01-16 |
| 11076509 | Control systems and prediction methods for it cooling performance in containment | Husam Atallah ALISSA, Kourosh Nemati, Kanad Ghose | 2021-07-27 |
| 10308856 | Pastes for thermal, electrical and mechanical bonding | Hao Wang | 2019-06-04 |
| 10064283 | Embedded thin films | Junghyun Cho, Mark D. Poliks, Roy H. Magnuson, Biplab K. Roy | 2018-08-28 |
| 9017808 | Composite thermal interface material system and method using nano-scale components | Hao Wang, Yayong Liu, Kaikun Yang | 2015-04-28 |
| 8882983 | Embedded thin films | Junghyun Cho, Mark D. Poliks, Roy H. Magnuson, Biplab K. Roy | 2014-11-11 |
| 8851159 | Method and pattern of dispensing thermal interface materials | Drew A. Davidson | 2014-10-07 |
| 8685529 | Surface coating for electronic systems | Junghyun Cho, Scott Oliver, Wayne E. Jones | 2014-04-01 |
| 8518304 | Nano-structure enhancements for anisotropic conductive material and thermal interposers | Wayne E. Jones, Ganesh Subbarayan | 2013-08-27 |
| 8481103 | Method and pattern of dispensing thermal interface materials | Drew A. Davidson | 2013-07-09 |
| 8277112 | Devices and fluid flow methods for improving mixing | Siddharth Bhopte, Bruce Murray | 2012-10-02 |
| 8173260 | Nano-structure enhancements for anisotropic conductive adhesive and thermal interposers | Wayne E. Jones, Ganesh Subbarayan | 2012-05-08 |
| 8158201 | Method of manufacturing surface coatings for electronic systems | Junghyun Cho, Scott Oliver, Wayne E. Jones | 2012-04-17 |
| 8129001 | Composite thermal interface material system and method using nano-scale components | Hao Wang, Yayong Liu, Kaikun Yang | 2012-03-06 |
| 7645512 | Nano-structure enhancements for anisotropic conductive adhesive and thermal interposers | Wayne E. Jones, Ganesh Subbarayan | 2010-01-12 |
| 7282254 | Surface coating for electronic systems | Junghyun Cho, Scott Oliver, Wayne E. Jones | 2007-10-16 |
| 6219234 | Method for using pulsating flow to improve thermal transport in systems | Sanjeev Sathe | 2001-04-17 |
| 6058015 | Electronic packages and a method to improve thermal performance of electronic packages | Sanjeev Sathe | 2000-05-02 |
| 5966290 | Electronic packages and a method to improve thermal performance of electronic packages | Sanjeev Sathe | 1999-10-12 |
| 5912800 | Electronic packages and method to enhance the passive thermal management of electronic packages | Sanjeev Sathe | 1999-06-15 |
| 5870285 | Assembly mounting techniques for heat sinks in electronic packaging | Stephen J. Kosteva | 1999-02-09 |
| 5491610 | Electronic package having active means to maintain its operating temperature constant | Lawrence S. Mok, Sampath Purushothaman, Janusz S. Wilczynski, Tien Y. Wu | 1996-02-13 |
| 5420520 | Method and apparatus for testing of integrated circuit chips | Morris Anschel, Anthony P. Ingraham, Charles Robert Lamb, Michael D. Lowell, Voya R. Markovich +7 more | 1995-05-30 |
| 5109318 | Pluggable electronic circuit package assembly with snap together heat sink housing | Joseph Funari, Terence C. Godown, Scott Reynolds | 1992-04-28 |