Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5631498 | Thin film metallization process for improved metal to substrate adhesion | Douglas William Ormond, Jr., Carl P. Hayunga | 1997-05-20 |
| 5420520 | Method and apparatus for testing of integrated circuit chips | Anthony P. Ingraham, Charles Robert Lamb, Michael D. Lowell, Voya R. Markovich, Wolfgang Mayr +7 more | 1995-05-30 |
| 5372685 | Process for coating a substrate with metallic layer | — | 1994-12-13 |
| 5104734 | Method for improving adhesion between a polyimide layer and a metal and the article obtained | — | 1992-04-14 |
| 4931310 | Process for treating the surface of polyimides to improve properties to receive metal layer | Walter P. Pawlowski | 1990-06-05 |
| 4914551 | Electronic package with heat spreader member | Bahgat Sammakia | 1990-04-03 |
| 4886727 | Method for developing negative photoresists | Lawrence D. Goodrich, Barton M. Hetrick | 1989-12-12 |
| 4335189 | Resolution standard for scanning electron microscope comprising palladium spines on a metal substrate | Carmelo F. Aliotta | 1982-06-15 |