| 5631498 |
Thin film metallization process for improved metal to substrate adhesion |
Douglas William Ormond, Jr., Carl P. Hayunga |
1997-05-20 |
| 5420520 |
Method and apparatus for testing of integrated circuit chips |
Anthony P. Ingraham, Charles Robert Lamb, Michael D. Lowell, Voya R. Markovich, Wolfgang Mayr +7 more |
1995-05-30 |
| 5372685 |
Process for coating a substrate with metallic layer |
— |
1994-12-13 |
| 5104734 |
Method for improving adhesion between a polyimide layer and a metal and the article obtained |
— |
1992-04-14 |
| 4931310 |
Process for treating the surface of polyimides to improve properties to receive metal layer |
Walter P. Pawlowski |
1990-06-05 |
| 4914551 |
Electronic package with heat spreader member |
Bahgat Sammakia |
1990-04-03 |
| 4886727 |
Method for developing negative photoresists |
Lawrence D. Goodrich, Barton M. Hetrick |
1989-12-12 |
| 4335189 |
Resolution standard for scanning electron microscope comprising palladium spines on a metal substrate |
Carmelo F. Aliotta |
1982-06-15 |
