CH

Carl P. Hayunga

IBM: 3 patents #26,272 of 70,183Top 40%
Overall (All Time): #1,643,587 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5631498 Thin film metallization process for improved metal to substrate adhesion Morris Anschel, Douglas William Ormond, Jr. 1997-05-20
4880684 Sealing and stress relief layers and use thereof David W. Boss, Timothy Carr, Derry J. Dubetsky, George M. Greenstein, Warren D. Grobman +6 more 1989-11-14
4238312 Sputtering system for optimizing quartz deposition uniformity Arkadi Galicki, Homi G. Sarkary 1980-12-09