Jack A. Varcoe — 8 Patents at IBM

Jack A. Varcoe has been granted 8 US patents while listed as an inventor at IBM. The first was granted in 1992 and the most recent in July 1999. Jack A. Varcoe ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Jack A. Varcoe in Endwell, NY, US.

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Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
5920125	Interconnection of a carrier substrate and a semiconductor device	James V. Ellerson, Joseph Funari	1999-07-06	$40,075,000
5859470	Interconnection of a carrier substrate and a semiconductor device	James V. Ellerson, Joseph Funari	1999-01-12	$24,935,000
5669137	Method of making electronic package assembly with protective encapsulant material	James V. Ellerson, Richard Joseph Noreika	1997-09-23	$16,549,000
5553769	Interconnection of a carrier substrate and a semiconductor device	James V. Ellerson, Joseph Funari	1996-09-10	$12,851,000
5469333	Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads	James V. Ellerson, Richard Joseph Noreika	1995-11-21	$10,808,000
5252179	Apparatus and method for selectively etching a plastic encapsulating material	James V. Ellerson, Louis J. Konrad, III, Ronald J. Moore	1993-10-12	$10,912,000
5185073	Method of fabricating nendritic materials	Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more	1993-02-09	$9,865,000
5137461	Separable electrical connection technology	Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more	1992-08-11	$12,814,000

Jack A. Varcoe — 8 Patents

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