| 5920125 |
Interconnection of a carrier substrate and a semiconductor device |
James V. Ellerson, Joseph Funari |
1999-07-06 |
| 5859470 |
Interconnection of a carrier substrate and a semiconductor device |
James V. Ellerson, Joseph Funari |
1999-01-12 |
| 5669137 |
Method of making electronic package assembly with protective encapsulant material |
James V. Ellerson, Richard Joseph Noreika |
1997-09-23 |
| 5553769 |
Interconnection of a carrier substrate and a semiconductor device |
James V. Ellerson, Joseph Funari |
1996-09-10 |
| 5469333 |
Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads |
James V. Ellerson, Richard Joseph Noreika |
1995-11-21 |
| 5252179 |
Apparatus and method for selectively etching a plastic encapsulating material |
James V. Ellerson, Louis J. Konrad, III, Ronald J. Moore |
1993-10-12 |
| 5185073 |
Method of fabricating nendritic materials |
Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more |
1993-02-09 |
| 5137461 |
Separable electrical connection technology |
Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more |
1992-08-11 |
