Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5920125 | Interconnection of a carrier substrate and a semiconductor device | James V. Ellerson, Joseph Funari | 1999-07-06 |
| 5859470 | Interconnection of a carrier substrate and a semiconductor device | James V. Ellerson, Joseph Funari | 1999-01-12 |
| 5669137 | Method of making electronic package assembly with protective encapsulant material | James V. Ellerson, Richard Joseph Noreika | 1997-09-23 |
| 5553769 | Interconnection of a carrier substrate and a semiconductor device | James V. Ellerson, Joseph Funari | 1996-09-10 |
| 5469333 | Electronic package assembly with protective encapsulant material on opposing sides not having conductive leads | James V. Ellerson, Richard Joseph Noreika | 1995-11-21 |
| 5252179 | Apparatus and method for selectively etching a plastic encapsulating material | James V. Ellerson, Louis J. Konrad, III, Ronald J. Moore | 1993-10-12 |
| 5185073 | Method of fabricating nendritic materials | Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more | 1993-02-09 |
| 5137461 | Separable electrical connection technology | Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more | 1992-08-11 |