| 6589376 |
Method and composition for mounting an electronic component and device formed therewith |
John G. Davis, Joseph D. Poole, Kris A. Slesinger |
2003-07-08 |
| 6590285 |
Method and composition for mounting an electronic component and device formed therewith |
John G. Davis, Joseph D. Poole, Kris A. Slesinger |
2003-07-08 |
| 6530412 |
Surface mount technology with masked cure |
John Cronin, Joseph D. Poole |
2003-03-11 |
| 6425515 |
Method and apparatus for micro BGA removal and reattach |
Allen Thomas Mays, Kris Allan Slesinger |
2002-07-30 |
| 6380494 |
Micro grid array solder interconnection structure with solder columns for second level packaging joining a module and printed circuit board |
Allen Thomas Mays, Kris Allan Slesinger |
2002-04-30 |
| 6340111 |
Micro grid array solder interconnection structure for second level packaging joining a module and a printed circuit board |
Allen Thomas Mays, Kris Allan Slesinger |
2002-01-22 |
| 6332267 |
Process of manufacturing a removably interlockable assembly |
John G. Davis, Richard Joseph Noreika |
2001-12-25 |
| 6196439 |
Method and apparatus for .mu.BGA removal and reattach |
Allen Thomas Mays, Kris Allan Slesinger |
2001-03-06 |
| 6179625 |
Removable interlockable first and second connectors having engaging flexible members and process of making same |
John G. Davis, Richard Joseph Noreika |
2001-01-30 |
| 6139661 |
Two step SMT method using masked cure |
John Cronin, Joseph D. Poole |
2000-10-31 |
| 6059173 |
Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board |
Allen Thomas Mays, Kris Allan Slesinger |
2000-05-09 |
| 5044615 |
Dual purpose work board holder |
Robert L. Newman, Frank P. Zickefoose |
1991-09-03 |
