| 7932342 |
Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system |
Steven E. Molis, Charles L. Reynolds, Jiali Wu |
2011-04-26 |
$6,102,000 |
| 7767575 |
Forming robust solder interconnect structures by reducing effects of seed layer underetching |
Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quinn +3 more |
2010-08-03 |
|
| 7473997 |
Method for forming robust solder interconnect structures by reducing effects of seed layer underetching |
Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quon +3 more |
2009-01-06 |
$2,860,000 |
| 6995084 |
Method for forming robust solder interconnect structures by reducing effects of seed layer underetching |
Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quon +3 more |
2006-02-07 |
$5,045,000 |
| 6892925 |
Solder hierarchy for lead free solder joint |
Mario J. Interrante, Mukta G. Farooq |
2005-05-17 |
$7,073,000 |
| 6854636 |
Structure and method for lead free solder electronic package interconnections |
Mukta G. Farooq, Mario J. Interrante |
2005-02-15 |
$11,729,000 |
| 6827505 |
Optoelectronic package structure and process for planar passive optical and optoelectronic devices |
Subhash L. Shinde, L. Wynn Herron, Mario J. Interrante, How T. Lin, Steven P. Ostrander +2 more |
2004-12-07 |
$6,343,000 |
| 6740959 |
EMI shielding for semiconductor chip carriers |
David J. Alcoe, Jeffrey T. Coffin, Michael A. Gaynes, Harvey C. Hamel, Mario J. Interrante +6 more |
2004-05-25 |
$11,301,000 |
| 6574859 |
Interconnection process for module assembly and rework |
Shaji Farooq, Mario J. Interrante, Sudipta K. Ray |
2003-06-10 |
$13,477,000 |
| 6518674 |
Temporary attach article and method for temporary attach of devices to a substrate |
Mario J. Interrante, Thomas E. Lombardi, Frank L. Pompeo |
2003-02-11 |
$11,665,000 |
| 6429388 |
High density column grid array connections and method thereof |
Mario J. Interrante, Brenda Peterson, Sudipta K. Ray, Amit K. Sarkhel |
2002-08-06 |
$5,918,000 |
| 6303400 |
Temporary attach article and method for temporary attach of devices to a substrate |
Mario J. Interrante, Thomas E. Lombardi, Frank L. Pompeo |
2001-10-16 |
$28,845,000 |
| 6283359 |
Method for enhancing fatigue life of ball grid arrays |
Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson +3 more |
2001-09-04 |
$27,475,000 |
| 6278184 |
Solder disc connection |
Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more |
2001-08-21 |
$21,309,000 |
| 6253986 |
Solder disc connection |
Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more |
2001-07-03 |
$26,086,000 |
| 6235996 |
Interconnection structure and process module assembly and rework |
Shaji Farooq, Mario J. Interrante, Sudipta K. Ray |
2001-05-22 |
$28,959,000 |
| 6158644 |
Method for enhancing fatigue life of ball grid arrays |
Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson +3 more |
2000-12-12 |
$56,886,000 |
| 6070321 |
Solder disc connection |
Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more |
2000-06-06 |
$33,361,000 |
| 6070782 |
Socketable bump grid array shaped-solder on copper spheres |
Peter J. Brofman, Balaram Ghosal, Raymond A. Jackson, Kathleen A. Lidestri, Karl J. Puttlitz |
2000-06-06 |
$33,361,000 |
| 5881944 |
Multi-layer solder seal band for semiconductor substrates |
David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr. +6 more |
1999-03-16 |
$18,667,000 |
| 5881945 |
Multi-layer solder seal band for semiconductor substrates and process |
David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr. +6 more |
1999-03-16 |
$18,667,000 |
| 5868304 |
Socketable bump grid array shaped-solder on copper spheres |
Peter J. Brofman, Balaram Ghosal, Raymond A. Jackson, Kathleen A. Lidestri, Karl J. Puttlitz |
1999-02-09 |
$13,231,000 |
| 5605277 |
Hot vacuum device removal process and apparatus |
Raymond A. Jackson, Kathleen A. Lidestri, David C. Linnell, Raj N. Master |
1997-02-25 |
$16,631,000 |
| 5543584 |
Structure for repairing electrical lines |
Edward F. Handford, Joseph M. Harvilchuck, Mario J. Interrante, Raymond A. Jackson, Raj N. Master +2 more |
1996-08-06 |
$6,901,000 |
| 5153408 |
Method and structure for repairing electrical lines |
Edward F. Handford, Joseph M. Harvilchuck, Mario J. Interrante, Raymond A. Jackson, Raj N. Master +2 more |
1992-10-06 |
$18,628,000 |
