Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932342 | Method to improve wettability by reducing liquid polymer macromolecule mobility through forming polymer blend system | Steven E. Molis, Charles L. Reynolds, Jiali Wu | 2011-04-26 |
| 7767575 | Forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quinn +3 more | 2010-08-03 |
| 7473997 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quon +3 more | 2009-01-06 |
| 6995084 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Subhash L. Shinde, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quon +3 more | 2006-02-07 |
| 6892925 | Solder hierarchy for lead free solder joint | Mario J. Interrante, Mukta G. Farooq | 2005-05-17 |
| 6854636 | Structure and method for lead free solder electronic package interconnections | Mukta G. Farooq, Mario J. Interrante | 2005-02-15 |
| 6827505 | Optoelectronic package structure and process for planar passive optical and optoelectronic devices | Subhash L. Shinde, L. Wynn Herron, Mario J. Interrante, How T. Lin, Steven P. Ostrander +2 more | 2004-12-07 |
| 6740959 | EMI shielding for semiconductor chip carriers | David J. Alcoe, Jeffrey T. Coffin, Michael A. Gaynes, Harvey C. Hamel, Mario J. Interrante +6 more | 2004-05-25 |
| 6574859 | Interconnection process for module assembly and rework | Shaji Farooq, Mario J. Interrante, Sudipta K. Ray | 2003-06-10 |
| 6518674 | Temporary attach article and method for temporary attach of devices to a substrate | Mario J. Interrante, Thomas E. Lombardi, Frank L. Pompeo | 2003-02-11 |
| 6429388 | High density column grid array connections and method thereof | Mario J. Interrante, Brenda Peterson, Sudipta K. Ray, Amit K. Sarkhel | 2002-08-06 |
| 6303400 | Temporary attach article and method for temporary attach of devices to a substrate | Mario J. Interrante, Thomas E. Lombardi, Frank L. Pompeo | 2001-10-16 |
| 6283359 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson +3 more | 2001-09-04 |
| 6278184 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more | 2001-08-21 |
| 6253986 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more | 2001-07-03 |
| 6235996 | Interconnection structure and process module assembly and rework | Shaji Farooq, Mario J. Interrante, Sudipta K. Ray | 2001-05-22 |
| 6158644 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson +3 more | 2000-12-12 |
| 6070782 | Socketable bump grid array shaped-solder on copper spheres | Peter J. Brofman, Balaram Ghosal, Raymond A. Jackson, Kathleen A. Lidestri, Karl J. Puttlitz | 2000-06-06 |
| 6070321 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, Raymond A. Jackson +3 more | 2000-06-06 |
| 5881945 | Multi-layer solder seal band for semiconductor substrates and process | David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr. +6 more | 1999-03-16 |
| 5881944 | Multi-layer solder seal band for semiconductor substrates | David L. Edwards, Armando S. Cammarano, Jeffrey T. Coffin, Mark G. Courtney, Stephen S. Drofitz, Jr. +6 more | 1999-03-16 |
| 5868304 | Socketable bump grid array shaped-solder on copper spheres | Peter J. Brofman, Balaram Ghosal, Raymond A. Jackson, Kathleen A. Lidestri, Karl J. Puttlitz | 1999-02-09 |
| 5605277 | Hot vacuum device removal process and apparatus | Raymond A. Jackson, Kathleen A. Lidestri, David C. Linnell, Raj N. Master | 1997-02-25 |
| 5543584 | Structure for repairing electrical lines | Edward F. Handford, Joseph M. Harvilchuck, Mario J. Interrante, Raymond A. Jackson, Raj N. Master +2 more | 1996-08-06 |
| 5153408 | Method and structure for repairing electrical lines | Edward F. Handford, Joseph M. Harvilchuck, Mario J. Interrante, Raymond A. Jackson, Raj N. Master +2 more | 1992-10-06 |