| 8026613 |
Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
Keith E. Fogel, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro, Henry A. Nye, III +2 more |
2011-09-27 |
| 7923849 |
Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
Keith E. Fogel, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro, Henry A. Nye, III +2 more |
2011-04-12 |
| 7410833 |
Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
Keith E. Fogel, Sung Kwon Kang, Stephen Kilpatrick, Paul A. Lauro, Henry A. Nye, III +2 more |
2008-08-12 |
| 6998327 |
Thin film transfer join process and multilevel thin film module |
Jeffrey B. Danielson, James Kuss, Matthew Oonk, Chandrika Prasad, Eric D. Perfecto +1 more |
2006-02-14 |
| 6070782 |
Socketable bump grid array shaped-solder on copper spheres |
Peter J. Brofman, Raymond A. Jackson, Kathleen A. Lidestri, Karl J. Puttlitz, William E. Sablinski |
2000-06-06 |
| 5868304 |
Socketable bump grid array shaped-solder on copper spheres |
Peter J. Brofman, Raymond A. Jackson, Kathleen A. Lidestri, Karl J. Puttlitz, William E. Sablinski |
1999-02-09 |
| 5670418 |
Method of joining an electrical contact element to a substrate |
— |
1997-09-23 |
| 5448016 |
Selectively coated member having a shank with a portion masked |
Nunzio DiPaolo, Kim H. Ruffing |
1995-09-05 |
| 5397598 |
Method for selectively coating a member having a shank by masking a portion of the shank with a washer |
Nunzio DiPaolo, Kim H. Ruffing |
1995-03-14 |
