Issued Patents All Time
Showing 25 most recent of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6719188 | Rework methods for lead BGA/CGA | Mukta G. Farooq, David C. Linnell | 2004-04-13 |
| 6548175 | Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof | Krishna G. Sachdev, Amy B. Ostrander, Charles H. Perry, Megan J. Shannon | 2003-04-15 |
| 6541305 | Single-melt enhanced reliability solder element interconnect | Mukta G. Farooq | 2003-04-01 |
| 6528352 | Use of conductive adhesive to form temporary electrical connections for use in TCA (temporary chip attach) applications | John U. Knickerbocker, Thomas E. Lombardi, Amy B. Ostrander | 2003-03-04 |
| 6497357 | Apparatus and method for removing interconnections | Scott A. Bradley, Stephen A. DeLaurentis, Mario J. Interrante, David C. Linnell | 2002-12-24 |
| 6458623 | Conductive adhesive interconnection with insulating polymer carrier | Lewis S. Goldmann, Mario J. Interrante, Amy B. Ostrander, Charles H. Perry, Brenda Peterson | 2002-10-01 |
| 6360938 | Process and apparatus to remove closely spaced chips on a multi-chip module | Stephen A. DeLaurentis, Mario J. Interrante, John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter | 2002-03-26 |
| 6335210 | Baseplate for chip burn-in and/of testing, and method thereof | Mukta S. Farooq, Sarah H. Knickerbocker, Sudipta K. Ray | 2002-01-01 |
| 6333563 | Electrical interconnection package and method thereof | Anson J. Call, Mark G. Courtney, Stephen A. DeLaurentis, Mukta S. Farooq, Shaji Farooq +3 more | 2001-12-25 |
| 6283359 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Gregory B. Martin +3 more | 2001-09-04 |
| 6278184 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, William E. Sablinski +3 more | 2001-08-21 |
| 6259155 | Polymer enhanced column grid array | Mario J. Interrante, Sudipta K. Ray, Paul A. Zucco, Scott R. Dwyer | 2001-07-10 |
| 6253986 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, William E. Sablinski +3 more | 2001-07-03 |
| 6226863 | Reworkability method for wirebond chips using high performance capacitor | Mukta S. Farooq, Sudipta K. Ray | 2001-05-08 |
| 6216937 | Process and apparatus to remove closely spaced chips on a multi-chip module | Stephen A. DeLaurentis, Mario J. Interrante, John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter | 2001-04-17 |
| 6158644 | Method for enhancing fatigue life of ball grid arrays | Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Gregory B. Martin +3 more | 2000-12-12 |
| 6070321 | Solder disc connection | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Lewis S. Goldmann, William E. Sablinski +3 more | 2000-06-06 |
| 6070782 | Socketable bump grid array shaped-solder on copper spheres | Peter J. Brofman, Balaram Ghosal, Kathleen A. Lidestri, Karl J. Puttlitz, William E. Sablinski | 2000-06-06 |
| 6015955 | Reworkability solution for wirebound chips using high performance capacitor | Mukta S. Farooq, Sudipta K. Ray | 2000-01-18 |
| 5975409 | Ceramic ball grid array using in-situ solder stretch | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann +5 more | 1999-11-02 |
| 5968670 | Enhanced ceramic ball grid array using in-situ solder stretch with spring | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, James H. Covell, Shaji Farooq +6 more | 1999-10-19 |
| 5964396 | Enhanced ceramic ball grid array using in-situ solder stretch with clip | Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann +5 more | 1999-10-12 |
| 5868304 | Socketable bump grid array shaped-solder on copper spheres | Peter J. Brofman, Balaram Ghosal, Kathleen A. Lidestri, Karl J. Puttlitz, William E. Sablinski | 1999-02-09 |
| 5779133 | In-situ device removal for multi-chip modules | Kathleen A. Lidestri, David C. Linnell, Raj N. Master | 1998-07-14 |
| 5605277 | Hot vacuum device removal process and apparatus | Kathleen A. Lidestri, William E. Sablinski, David C. Linnell, Raj N. Master | 1997-02-25 |