GM

Gregory B. Martin

IBM: 10 patents #10,888 of 70,183Top 20%
Overall (All Time): #523,093 of 4,157,543Top 15%
10
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6900395 Enhanced high-frequency via interconnection for improved reliability Janet L. Jozwiak, Linda L. Rapp, Srinivasa S. N. Reddy 2005-05-31
6858111 Conductive polymer interconnection configurations Charles H. Perry, Mark G. Courtney, Lewis S. Goldmann 2005-02-22
6532654 Method of forming an electrical connector Luc Guerin, Mario J. Interrante, Mark J. LaPlante, David C. Long, Thomas P. Moyer +2 more 2003-03-18
6333563 Electrical interconnection package and method thereof Raymond A. Jackson, Anson J. Call, Mark G. Courtney, Stephen A. DeLaurentis, Mukta S. Farooq +3 more 2001-12-25
6333104 Conductive polymer interconnection configurations Charles H. Perry, Mark G. Courtney, Lewis S. Goldmann 2001-12-25
6283359 Method for enhancing fatigue life of ball grid arrays Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson +3 more 2001-09-04
6158644 Method for enhancing fatigue life of ball grid arrays Peter J. Brofman, Mark G. Courtney, Shaji Farooq, Mario J. Interrante, Raymond A. Jackson +3 more 2000-12-12
5975409 Ceramic ball grid array using in-situ solder stretch Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann +5 more 1999-11-02
5968670 Enhanced ceramic ball grid array using in-situ solder stretch with spring Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, James H. Covell, Shaji Farooq +6 more 1999-10-19
5964396 Enhanced ceramic ball grid array using in-situ solder stretch with clip Peter J. Brofman, Patrick A. Coico, Mark G. Courtney, Shaji Farooq, Lewis S. Goldmann +5 more 1999-10-12