| 10926813 |
Wind deflector for a vehicle towing a trailer |
— |
2021-02-23 |
| 10784202 |
High-density chip-to-chip interconnection with silicon bridge |
Francois Arguin, Maryse Cournoyer, Steve Whitehead, Jean Audet, Richard Langlois +3 more |
2020-09-22 |
| 10211174 |
Flip chip assembly with connected component |
Jean Audet, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet |
2019-02-19 |
| 9984988 |
Flip chip assembly with connected component |
Jean Audet, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet |
2018-05-29 |
| 9865564 |
Laser ashing of polyimide for semiconductor manufacturing |
Maxime Cadotte, Van Thanh Truong, Steve Whitehead |
2018-01-09 |
| 9793232 |
All intermetallic compound with stand off feature and method to make |
Charles L. Arvin, Sylvain E. Ouimet, Sylvain Pharand, Thomas A. Wassick |
2017-10-17 |
| 9553079 |
Flip chip assembly with connected component |
Jean Audet, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet |
2017-01-24 |
| 9269603 |
Temporary liquid thermal interface material for surface tension adhesion and thermal control |
Marc D. Knox, George J. Lawson, Van Thanh Truong, Steve Whitehead |
2016-02-23 |
| 8999107 |
Laser ashing of polyimide for semiconductor manufacturing |
Maxime Cadotte, Van Thanh Truong, Steve Whitehead |
2015-04-07 |
| 8614512 |
Solder ball contact susceptible to lower stress |
Mario J. Interrante, Michael J. Shapiro, Thuy L. Tran-Quinn, Van Thanh Truong |
2013-12-24 |
| 8559474 |
Silicon carrier optoelectronic packaging |
Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano +4 more |
2013-10-15 |
| 8514386 |
Technique for verifying the microstructure of lead-free interconnects in semiconductor assemblies |
Christian Bergeron, Pascal Blais, Clement Fortin |
2013-08-20 |
| 8383505 |
Solder ball contact susceptible to lower stress |
Mario J. Interrante, Michael J. Shapiro, Thuy L. Tran-Quinn, Van Thanh Truong |
2013-02-26 |
| 8328156 |
Techniques for forming solder bump interconnects |
Bing Dang, Peter A. Gruber, Chirag S. Patel |
2012-12-11 |
| 8290008 |
Silicon carrier optoelectronic packaging |
Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano +4 more |
2012-10-16 |
| 8148255 |
Techniques for forming solder bump interconnects |
Bing Dang, Peter A. Gruber, Chirag S. Patel |
2012-04-03 |
| 7868459 |
Semiconductor package having non-aligned active vias |
Jean Audet, David L. Questad, David J. Russell |
2011-01-11 |
| 7837419 |
Methods involving marking molds |
Eric Bouchard, Robert Haas |
2010-11-23 |
| 7312523 |
Enhanced via structure for organic module performance |
Jean Audet, Jon A. Casey, David L. Questad, David J. Russell |
2007-12-25 |
| 7066740 |
Area array package with low inductance connecting device |
Jean Audet, Jean-Luc Landreville, Gerald P. Audet |
2006-06-27 |
| 6652290 |
Connecting devices and method for interconnecting circuit components |
Gerald P. Audet, Jean-Luc Landreville |
2003-11-25 |
| 6532654 |
Method of forming an electrical connector |
Mario J. Interrante, Mark J. LaPlante, David C. Long, Gregory B. Martin, Thomas P. Moyer +2 more |
2003-03-18 |
| 6339534 |
Compliant leads for area array surface mounted components |
Patrick A. Coico |
2002-01-15 |
| 6302702 |
Connecting devices and method for interconnecting circuit components |
Gerald P. Audet, Jean-Luc Landreville |
2001-10-16 |
