Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10926813 | Wind deflector for a vehicle towing a trailer | — | 2021-02-23 |
| 10784202 | High-density chip-to-chip interconnection with silicon bridge | Francois Arguin, Maryse Cournoyer, Steve Whitehead, Jean Audet, Richard Langlois +3 more | 2020-09-22 |
| 10211174 | Flip chip assembly with connected component | Jean Audet, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet | 2019-02-19 |
| 9984988 | Flip chip assembly with connected component | Jean Audet, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet | 2018-05-29 |
| 9865564 | Laser ashing of polyimide for semiconductor manufacturing | Maxime Cadotte, Van Thanh Truong, Steve Whitehead | 2018-01-09 |
| 9793232 | All intermetallic compound with stand off feature and method to make | Charles L. Arvin, Sylvain E. Ouimet, Sylvain Pharand, Thomas A. Wassick | 2017-10-17 |
| 9553079 | Flip chip assembly with connected component | Jean Audet, Richard Langlois, Stephan L. Martel, Sylvain E. Ouimet | 2017-01-24 |
| 9269603 | Temporary liquid thermal interface material for surface tension adhesion and thermal control | Marc D. Knox, George J. Lawson, Van Thanh Truong, Steve Whitehead | 2016-02-23 |
| 8999107 | Laser ashing of polyimide for semiconductor manufacturing | Maxime Cadotte, Van Thanh Truong, Steve Whitehead | 2015-04-07 |
| 8614512 | Solder ball contact susceptible to lower stress | Mario J. Interrante, Michael J. Shapiro, Thuy L. Tran-Quinn, Van Thanh Truong | 2013-12-24 |
| 8559474 | Silicon carrier optoelectronic packaging | Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano +4 more | 2013-10-15 |
| 8514386 | Technique for verifying the microstructure of lead-free interconnects in semiconductor assemblies | Christian Bergeron, Pascal Blais, Clement Fortin | 2013-08-20 |
| 8383505 | Solder ball contact susceptible to lower stress | Mario J. Interrante, Michael J. Shapiro, Thuy L. Tran-Quinn, Van Thanh Truong | 2013-02-26 |
| 8328156 | Techniques for forming solder bump interconnects | Bing Dang, Peter A. Gruber, Chirag S. Patel | 2012-12-11 |
| 8290008 | Silicon carrier optoelectronic packaging | Paul S. Andry, Russell A. Budd, Bing Dang, David Danovitch, Benjamin V. Fasano +4 more | 2012-10-16 |
| 8148255 | Techniques for forming solder bump interconnects | Bing Dang, Peter A. Gruber, Chirag S. Patel | 2012-04-03 |
| 7868459 | Semiconductor package having non-aligned active vias | Jean Audet, David L. Questad, David J. Russell | 2011-01-11 |
| 7837419 | Methods involving marking molds | Eric Bouchard, Robert Haas | 2010-11-23 |
| 7312523 | Enhanced via structure for organic module performance | Jean Audet, Jon A. Casey, David L. Questad, David J. Russell | 2007-12-25 |
| 7066740 | Area array package with low inductance connecting device | Jean Audet, Jean-Luc Landreville, Gerald P. Audet | 2006-06-27 |
| 6652290 | Connecting devices and method for interconnecting circuit components | Gerald P. Audet, Jean-Luc Landreville | 2003-11-25 |
| 6532654 | Method of forming an electrical connector | Mario J. Interrante, Mark J. LaPlante, David C. Long, Gregory B. Martin, Thomas P. Moyer +2 more | 2003-03-18 |
| 6339534 | Compliant leads for area array surface mounted components | Patrick A. Coico | 2002-01-15 |
| 6302702 | Connecting devices and method for interconnecting circuit components | Gerald P. Audet, Jean-Luc Landreville | 2001-10-16 |