Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9805977 | Integrated circuit structure having through-silicon via and method of forming same | Vijay Sukumaran, Jorge A. Lubguban, John J. Garant | 2017-10-31 |
| 9252133 | Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures | Christopher N. Collins, Mukta G. Farooq, Troy L. Graves-Abe, Joyce C. Liu, Gerd Pfeiffer | 2016-02-02 |
| 8907494 | Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures | Christopher N. Collins, Mukta G. Farooq, Troy L. Graves-Abe, Joyce C. Liu, Gerd Pfeiffer | 2014-12-09 |
| 8614512 | Solder ball contact susceptible to lower stress | Luc Guerin, Mario J. Interrante, Michael J. Shapiro, Van Thanh Truong | 2013-12-24 |
| 8383505 | Solder ball contact susceptible to lower stress | Luc Guerin, Mario J. Interrante, Michael J. Shapiro, Van Thanh Truong | 2013-02-26 |