JL

Joyce C. Liu

IBM: 18 patents #6,125 of 70,183Top 9%
Globalfoundries: 5 patents #673 of 4,424Top 20%
Infineon Technologies Ag: 1 patents #4,439 of 7,486Top 60%
MI Magna International: 1 patents #245 of 578Top 45%
Overall (All Time): #170,727 of 4,157,543Top 5%
24
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12103068 Smart trim die assembly Wally Kroeger, Owen Li, Lee Zhao, Les Shuman 2024-10-01
10446484 Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability John M. Safran, Jochonia N. Nxumalo, Sami Rosenblatt, Chandrasekharan Kothandaraman 2019-10-15
10095115 Forming edge etch protection using dual layer of positive-negative tone resists Christopher B. Shing, Richard D. Kaplan, Timothy J. Wiltshire, Darius Brown 2018-10-09
9847290 Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability John M. Safran, Jochonia N. Nxumalo, Sami Rosenblatt, Chandrasekharan Kothandaraman 2017-12-19
9728506 Strain engineering devices using partial depth films in through-substrate vias Mukta G. Farooq, Jennifer A. Oakley 2017-08-08
9252133 Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures Christopher N. Collins, Mukta G. Farooq, Troy L. Graves-Abe, Gerd Pfeiffer, Thuy L. Tran-Quinn 2016-02-02
8907494 Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures Christopher N. Collins, Mukta G. Farooq, Troy L. Graves-Abe, Gerd Pfeiffer, Thuy L. Tran-Quinn 2014-12-09
7858485 Structure and method for manufacturing trench capacitance Huilong Zhu, Babar A. Khan, Xi Li, Thomas A. Wallner 2010-12-28
7081393 Reduced dielectric constant spacer materials integration for high speed logic gates Michael P. Belyansky, Hsing-Jen Wann, Richard S. Wise, Hongwen Yan 2006-07-25
6838347 Method for reducing line edge roughness of oxide material using chemical oxide removal Wesley C. Natzle, Richard S. Wise, Hongwen Yan, Bidan Zhang 2005-01-04
6828187 Method for uniform reactive ion etching of dual pre-doped polysilicon regions Len Yuan Tsou, Qingyun Yang 2004-12-07
6821890 Method for improving adhesion to copper Vincent J. McGahay, Thomas Ivers, Henry A. Nye, III 2004-11-23
6727589 Dual damascene flowable oxide insulation structure and metallic barrier Stephen E. Greco, John P. Hummel, Vincent J. McGahay, Rebecca D. Mih, Kamalesh K. Srivastava 2004-04-27
6720249 Protective hardmask for producing interconnect structures Timothy J. Dalton, Christopher V. Jahnes, Sampath Purushothaman 2004-04-13
6703312 Method of forming active devices of different gatelengths using lithographic printed gate images of same length John W. Golz, Babar A. Khan, Christopher J. Waskiewicz, Teresa J. Wu 2004-03-09
6518151 Dual layer hard mask for eDRAM gate etch process David M. Dobuzinsky, Babar A. Khan, Paul Wensley, Chienfan Yu 2003-02-11
6479884 Interim oxidation of silsesquioxane dielectric for dual damascene process Robert Cook, Stephen E. Greco, John P. Hummel, Vincent J. McGahay, Rebecca D. Mih +1 more 2002-11-12
6429067 Dual mask process for semiconductor devices James C. Brighten, Jeffrey J. Brown, John W. Golz, George A. Kaplita, Rebecca D. Mih +4 more 2002-08-06
6348076 Slurry for mechanical polishing (CMP) of metals and use thereof Donald F. Canaperi, William J. Cote, Paul M. Feeney, Mahadevaiyer Krishnan, Michael F. Lofaro +2 more 2002-02-19
6348736 In situ formation of protective layer on silsesquioxane dielectric for dual damascene process Vincent J. McGahay, John P. Hummel, Rebecca D. Mih, Kamalesh K. Srivastava, Robert Cook +1 more 2002-02-19
6329280 Interim oxidation of silsesquioxane dielectric for dual damascene process Robert Cook, Stephen E. Greco, John P. Hummel, Vincent J. McGahay, Rebecca D. Mih +1 more 2001-12-11
6284574 Method of producing heat dissipating structure for semiconductor devices Kevin S. Petrarca, Sarah H. Knickerbocker, Rebecca D. Mih 2001-09-04
6271595 Method for improving adhesion to copper Vincent J. McGahay, Thomas Ivers, Henry A. Nye, III 2001-08-07
6221780 Dual damascene flowable oxide insulation structure and metallic barrier Stephen E. Greco, John P. Hummel, Vincent J. McGahay, Rebecca D. Mih, Kamalesh K. Srivastava 2001-04-24