| 12103068 |
Smart trim die assembly |
Wally Kroeger, Owen Li, Lee Zhao, Les Shuman |
2024-10-01 |
$36,209,000 |
| 10446484 |
Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability |
John M. Safran, Jochonia N. Nxumalo, Sami Rosenblatt, Chandrasekharan Kothandaraman |
2019-10-15 |
$19,042,000 |
| 10095115 |
Forming edge etch protection using dual layer of positive-negative tone resists |
Christopher B. Shing, Richard D. Kaplan, Timothy J. Wiltshire, Darius Brown |
2018-10-09 |
$19,488,000 |
| 9847290 |
Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability |
John M. Safran, Jochonia N. Nxumalo, Sami Rosenblatt, Chandrasekharan Kothandaraman |
2017-12-19 |
$11,941,000 |
| 9728506 |
Strain engineering devices using partial depth films in through-substrate vias |
Mukta G. Farooq, Jennifer A. Oakley |
2017-08-08 |
$10,842,000 |
| 9252133 |
Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures |
Christopher N. Collins, Mukta G. Farooq, Troy L. Graves-Abe, Gerd Pfeiffer, Thuy L. Tran-Quinn |
2016-02-02 |
$567,000 |
| 8907494 |
Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures |
Christopher N. Collins, Mukta G. Farooq, Troy L. Graves-Abe, Gerd Pfeiffer, Thuy L. Tran-Quinn |
2014-12-09 |
$5,061,000 |
| 7858485 |
Structure and method for manufacturing trench capacitance |
Huilong Zhu, Babar A. Khan, Xi Li, Thomas A. Wallner |
2010-12-28 |
$5,922,000 |
| 7081393 |
Reduced dielectric constant spacer materials integration for high speed logic gates |
Michael P. Belyansky, Hsing-Jen Wann, Richard S. Wise, Hongwen Yan |
2006-07-25 |
$9,389,000 |
| 6838347 |
Method for reducing line edge roughness of oxide material using chemical oxide removal |
Wesley C. Natzle, Richard S. Wise, Hongwen Yan, Bidan Zhang |
2005-01-04 |
$10,543,000 |
| 6828187 |
Method for uniform reactive ion etching of dual pre-doped polysilicon regions |
Len Yuan Tsou, Qingyun Yang |
2004-12-07 |
$6,343,000 |
| 6821890 |
Method for improving adhesion to copper |
Vincent J. McGahay, Thomas Ivers, Henry A. Nye, III |
2004-11-23 |
$4,043,000 |
| 6727589 |
Dual damascene flowable oxide insulation structure and metallic barrier |
Stephen E. Greco, John P. Hummel, Vincent J. McGahay, Rebecca D. Mih, Kamalesh K. Srivastava |
2004-04-27 |
$8,134,000 |
| 6720249 |
Protective hardmask for producing interconnect structures |
Timothy J. Dalton, Christopher V. Jahnes, Sampath Purushothaman |
2004-04-13 |
$7,725,000 |
| 6703312 |
Method of forming active devices of different gatelengths using lithographic printed gate images of same length |
John W. Golz, Babar A. Khan, Christopher J. Waskiewicz, Teresa J. Wu |
2004-03-09 |
$11,976,000 |
| 6518151 |
Dual layer hard mask for eDRAM gate etch process |
David M. Dobuzinsky, Babar A. Khan, Paul Wensley, Chienfan Yu |
2003-02-11 |
|
| 6479884 |
Interim oxidation of silsesquioxane dielectric for dual damascene process |
Robert Cook, Stephen E. Greco, John P. Hummel, Vincent J. McGahay, Rebecca D. Mih +1 more |
2002-11-12 |
$19,603,000 |
| 6429067 |
Dual mask process for semiconductor devices |
James C. Brighten, Jeffrey J. Brown, John W. Golz, George A. Kaplita, Rebecca D. Mih +4 more |
2002-08-06 |
$5,918,000 |
| 6348076 |
Slurry for mechanical polishing (CMP) of metals and use thereof |
Donald F. Canaperi, William J. Cote, Paul M. Feeney, Mahadevaiyer Krishnan, Michael F. Lofaro +2 more |
2002-02-19 |
$18,993,000 |
| 6348736 |
In situ formation of protective layer on silsesquioxane dielectric for dual damascene process |
Vincent J. McGahay, John P. Hummel, Rebecca D. Mih, Kamalesh K. Srivastava, Robert Cook +1 more |
2002-02-19 |
$18,993,000 |
| 6329280 |
Interim oxidation of silsesquioxane dielectric for dual damascene process |
Robert Cook, Stephen E. Greco, John P. Hummel, Vincent J. McGahay, Rebecca D. Mih +1 more |
2001-12-11 |
$30,954,000 |
| 6284574 |
Method of producing heat dissipating structure for semiconductor devices |
Kevin S. Petrarca, Sarah H. Knickerbocker, Rebecca D. Mih |
2001-09-04 |
$27,475,000 |
| 6271595 |
Method for improving adhesion to copper |
Vincent J. McGahay, Thomas Ivers, Henry A. Nye, III |
2001-08-07 |
$22,988,000 |
| 6221780 |
Dual damascene flowable oxide insulation structure and metallic barrier |
Stephen E. Greco, John P. Hummel, Vincent J. McGahay, Rebecca D. Mih, Kamalesh K. Srivastava |
2001-04-24 |
$20,927,000 |
