| 9865564 |
Laser ashing of polyimide for semiconductor manufacturing |
Maxime Cadotte, Luc Guerin, Steve Whitehead |
2018-01-09 |
| 9269603 |
Temporary liquid thermal interface material for surface tension adhesion and thermal control |
Luc Guerin, Marc D. Knox, George J. Lawson, Steve Whitehead |
2016-02-23 |
| 8999107 |
Laser ashing of polyimide for semiconductor manufacturing |
Maxime Cadotte, Luc Guerin, Steve Whitehead |
2015-04-07 |
| 8689437 |
Method for forming integrated circuit assembly |
Bing Dang, David Danovitch, Mario J. Interrante, John U. Knickerbocker, Michael J. Shapiro |
2014-04-08 |
| 8614512 |
Solder ball contact susceptible to lower stress |
Luc Guerin, Mario J. Interrante, Michael J. Shapiro, Thuy L. Tran-Quinn |
2013-12-24 |
| 8383505 |
Solder ball contact susceptible to lower stress |
Luc Guerin, Mario J. Interrante, Michael J. Shapiro, Thuy L. Tran-Quinn |
2013-02-26 |