Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11139269 | Mixed under bump metallurgy (UBM) interconnect bridge structure | Kamal K. Sikka, Paul S. Andry, Yang Liu, Pascale Gagnon, Maryse Cournoyer | 2021-10-05 |
| 10784202 | High-density chip-to-chip interconnection with silicon bridge | Francois Arguin, Luc Guerin, Maryse Cournoyer, Steve Whitehead, Jean Audet +3 more | 2020-09-22 |
| 8514386 | Technique for verifying the microstructure of lead-free interconnects in semiconductor assemblies | Pascal Blais, Clement Fortin, Luc Guerin | 2013-08-20 |
| 6333491 | Apparatus and method for non-destructive, low stress removal of soldered electronic components | Raymond Lord, Mario Racicot | 2001-12-25 |
| 6320163 | Apparatus and method for non-destructive, low stress removal of soldered electronic components | Raymond Lord, Mario Racicot | 2001-11-20 |
| 6163014 | Apparatus and method for non-destructive, low stress removal of soldered electronic components | Raymond Lord, Mario Racicot | 2000-12-19 |