Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791270 | Direct bonded heterogeneous integration silicon bridge | Kamal K. Sikka, Maryse Cournoyer, Charles C. Bureau, Catherine Dufort, Dale Curtis McHerron +8 more | 2023-10-17 |
| 11139269 | Mixed under bump metallurgy (UBM) interconnect bridge structure | Kamal K. Sikka, Paul S. Andry, Yang Liu, Christian Bergeron, Maryse Cournoyer | 2021-10-05 |
| 10784202 | High-density chip-to-chip interconnection with silicon bridge | Francois Arguin, Luc Guerin, Maryse Cournoyer, Steve Whitehead, Jean Audet +3 more | 2020-09-22 |
| 9042120 | Grounded lid for micro-electronic assemblies | Martin Beaumier, Alexandre Blander, Michael A. Gaynes, Eric Giguere, Eric Salvas +1 more | 2015-05-26 |
| 8614900 | Grounded lid for micro-electronic assemblies | Martin Beaumier, Alexandre Blander, Michael A. Gaynes, Eric Giguere, Eric Salvas +1 more | 2013-12-24 |