Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10896862 | Thermal interface material on package | Isabel De Sousa, Annique Lavoie, Michel Turgeon | 2021-01-19 |
| 9941184 | Thermal interface material on package | Isabel De Sousa, Annique Lavoie, Michel Turgeon | 2018-04-10 |
| 9881848 | Thermal interface material on package | Isabel De Sousa, Annique Lavoie, Michel Turgeon | 2018-01-30 |
| 9761505 | Thermal interface material on package | Isabel De Sousa, Annique Lavoie, Michel Turgeon | 2017-09-12 |
| 9646913 | Thermal interface material on package | Isabel De Sousa, Annique Lavoie, Michel Turgeon | 2017-05-09 |
| 9576878 | Thermal interface material on package | Isabel De Sousa, Annique Lavoie, Michel Turgeon | 2017-02-21 |
| 9257307 | Thermal interface material on package | Isabel De Sousa, Annique Lavoie, Michel Turgeon | 2016-02-09 |
| 9257308 | Thermal interface material on package | Isabel De Sousa, Annique Lavoie, Michel Turgeon | 2016-02-09 |
| 9252121 | Thermal interface material on package | Isabel De Sousa, Annique Lavoie, Michel Turgeon | 2016-02-02 |
| 9252029 | Thermal interface material on package | Isabel De Sousa, Annique Lavoie, Michel Turgeon | 2016-02-02 |
| 9042120 | Grounded lid for micro-electronic assemblies | Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere +1 more | 2015-05-26 |
| 8614900 | Grounded lid for micro-electronic assemblies | Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere +1 more | 2013-12-24 |
| 8421217 | Achieving mechanical and thermal stability in a multi-chip package | Jon A. Casey, John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav +4 more | 2013-04-16 |
| 8202765 | Achieving mechanical and thermal stability in a multi-chip package | Jon A. Casey, John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav +4 more | 2012-06-19 |