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USPTO Patent Rankings Data through Dec 31, 2025
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Eric Salvas — 14 Patents

IBM: 14 patents #8,031 of 70,183Top 15%
Otterburn Park, CA: #2 of 37 inventorsTop 6%
Overall (All Time): #332,869 of 4,157,543Top 9%
14 Patents All Time
Eric Salvas has been granted 14 US patents while listed as an inventor at IBM. The first was granted in 2012 and the most recent in January 2021. Eric Salvas ranks #332,869 of 4,157,543 US inventors in our database (top 8.0%). Patent records list Eric Salvas in Otterburn Park, QC, CA.

Issued Patents All Time

Showing 1–14 of 14 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10896862 Thermal interface material on package Isabel De Sousa, Annique Lavoie, Michel Turgeon 2021-01-19 $4,840,000
9941184 Thermal interface material on package Isabel De Sousa, Annique Lavoie, Michel Turgeon 2018-04-10 $2,135,000
9881848 Thermal interface material on package Isabel De Sousa, Annique Lavoie, Michel Turgeon 2018-01-30 $2,622,000
9761505 Thermal interface material on package Isabel De Sousa, Annique Lavoie, Michel Turgeon 2017-09-12 $1,776,000
9646913 Thermal interface material on package Isabel De Sousa, Annique Lavoie, Michel Turgeon 2017-05-09 $2,584,000
9576878 Thermal interface material on package Isabel De Sousa, Annique Lavoie, Michel Turgeon 2017-02-21 $2,827,000
9257307 Thermal interface material on package Isabel De Sousa, Annique Lavoie, Michel Turgeon 2016-02-09 $2,307,000
9257308 Thermal interface material on package Isabel De Sousa, Annique Lavoie, Michel Turgeon 2016-02-09 $2,307,000
9252121 Thermal interface material on package Isabel De Sousa, Annique Lavoie, Michel Turgeon 2016-02-02 $1,325,000
9252029 Thermal interface material on package Isabel De Sousa, Annique Lavoie, Michel Turgeon 2016-02-02 $1,325,000
9042120 Grounded lid for micro-electronic assemblies Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere +1 more 2015-05-26 $2,909,000
8614900 Grounded lid for micro-electronic assemblies Martin Beaumier, Alexandre Blander, Pascale Gagnon, Michael A. Gaynes, Eric Giguere +1 more 2013-12-24 $7,453,000
8421217 Achieving mechanical and thermal stability in a multi-chip package Jon A. Casey, John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav +4 more 2013-04-16 $3,567,000
8202765 Achieving mechanical and thermal stability in a multi-chip package Jon A. Casey, John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav +4 more 2012-06-19 $12,855,000