Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791270 | Direct bonded heterogeneous integration silicon bridge | Kamal K. Sikka, Maryse Cournoyer, Pascale Gagnon, Charles C. Bureau, Catherine Dufort +8 more | 2023-10-17 |
| 11209598 | Photonics package with face-to-face bonding | Barnim Alexander Janta-Polczynski, Jean Audet, Maryse Cournoyer, Sylvain Pharand, Roxan Lemire +2 more | 2021-12-28 |
| 10896862 | Thermal interface material on package | Annique Lavoie, Eric Salvas, Michel Turgeon | 2021-01-19 |
| 9941184 | Thermal interface material on package | Annique Lavoie, Eric Salvas, Michel Turgeon | 2018-04-10 |
| 9881848 | Thermal interface material on package | Annique Lavoie, Eric Salvas, Michel Turgeon | 2018-01-30 |
| 9761505 | Thermal interface material on package | Annique Lavoie, Eric Salvas, Michel Turgeon | 2017-09-12 |
| 9646913 | Thermal interface material on package | Annique Lavoie, Eric Salvas, Michel Turgeon | 2017-05-09 |
| 9576878 | Thermal interface material on package | Annique Lavoie, Eric Salvas, Michel Turgeon | 2017-02-21 |
| 9257307 | Thermal interface material on package | Annique Lavoie, Eric Salvas, Michel Turgeon | 2016-02-09 |
| 9257308 | Thermal interface material on package | Annique Lavoie, Eric Salvas, Michel Turgeon | 2016-02-09 |
| 9252029 | Thermal interface material on package | Annique Lavoie, Eric Salvas, Michel Turgeon | 2016-02-02 |
| 9252121 | Thermal interface material on package | Annique Lavoie, Eric Salvas, Michel Turgeon | 2016-02-02 |
| 7293354 | Apparatus for mounting columns for grid array electronic packages | Yvan Ferland, Stephane Harel | 2007-11-13 |