Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6070782 | Socketable bump grid array shaped-solder on copper spheres | Peter J. Brofman, Balaram Ghosal, Raymond A. Jackson, Karl J. Puttlitz, William E. Sablinski | 2000-06-06 |
| 5868304 | Socketable bump grid array shaped-solder on copper spheres | Peter J. Brofman, Balaram Ghosal, Raymond A. Jackson, Karl J. Puttlitz, William E. Sablinski | 1999-02-09 |
| 5779133 | In-situ device removal for multi-chip modules | Raymond A. Jackson, David C. Linnell, Raj N. Master | 1998-07-14 |
| 5605277 | Hot vacuum device removal process and apparatus | Raymond A. Jackson, William E. Sablinski, David C. Linnell, Raj N. Master | 1997-02-25 |
| 5553766 | In-situ device removal for multi-chip modules | Raymond A. Jackson, David C. Linnell, Raj N. Master | 1996-09-10 |
| 5284286 | Porous metal block for removing solder or braze from a substate and a process for making the same | Peter J. Brofman, Shaji Farooq, Gregg B. Monjeau, Karl J. Puttlitz | 1994-02-08 |
| 5219520 | Process of making a porous metal block for removing solder or braze | Peter J. Brofman, Shaji Farooq, Gregg B. Monjeau, Karl J. Puttlitz | 1993-06-15 |