{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Temporary attach article and method for temporary attach of devices to a substrate", "item": "https://www.patentleaderboard.com/patent/6303400"}]}
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Home › Temporary attach article and method for temporary attach of devices to a substrate

Temporary attach article and method for temporary attach of devices to a substrate

US Patent 6303400 · Granted Oct 16, 2001

Estimated economic value: $28,845,000 ⓘ

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