Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Temporary attach article and method for temporary attach of devices to a substrate

Temporary attach article and method for temporary attach of devices to a substrate

US Patent 6518674 · Granted Feb 11, 2003

Estimated economic value: $11,665,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic package with varying interconnects2024
Coolant-cooled heat sink(s) with associated ultra-violet light assembly2024
High power device fault localization via die surface contouring2024
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protec2023
Near tier decoupling capacitors2023
Fixture facilitating heat sink fabrication2022
Connecting a component to a substrate by adhesion to an oxidized solder surface2022
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the 2021
Structure with controlled capillary coverage2021
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protec2021
Mitigating cracking within integrated circuit (IC) device carrier2021
Fixture facilitating heat sink fabrication2021