| 5565235 |
Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate |
Donald W. Baudrand, Rebecca P. Fleming, John J. Gniewek, Arnold F. Schmeckenbecher |
1996-10-15 |
| 5543584 |
Structure for repairing electrical lines |
Edward F. Handford, Mario J. Interrante, Raymond A. Jackson, Raj N. Master, Sudipta K. Ray +2 more |
1996-08-06 |
| 5403650 |
Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate and products produced thereby |
Donald W. Baudrand, Rebecca P. Fleming, John J. Gniewek, Arnold F. Schmeckenbecher |
1995-04-04 |
| 5153408 |
Method and structure for repairing electrical lines |
Edward F. Handford, Mario J. Interrante, Raymond A. Jackson, Raj N. Master, Sudipta K. Ray +2 more |
1992-10-06 |
| 5130067 |
Method and means for co-sintering ceramic/metal MLC substrates |
Philip L. Flaitz, Arlyne M. Flanagan, Lester W. Herron, John U. Knickerbocker, Robert W. Nufer +3 more |
1992-07-14 |
| 5052481 |
High conduction cooling module having internal fins and compliant interfaces for VLSI chip technology |
Joseph L. Horvath, Robert G. Biskeborn |
1991-10-01 |
| 4962294 |
Method and apparatus for causing an open circuit in a conductive line |
Keith F. Beckham, David Carroll Challener, Arunava Gupta, James M. Leas, James Lloyd +4 more |
1990-10-09 |
| 4634638 |
High melting point copper-gold-tin brazing alloy for chip carriers |
Norman G. Ainslie, Mario J. Interrante, William J. King, Paul H. Palmateer, John F. Sullivan |
1987-01-06 |
| 4601424 |
Stripped gold plating process |
Avinash S. Adwalpalker, Joseph R. Ranalli, David Rich |
1986-07-22 |
