Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362279 | Semiconducting devices, back end of line portions for semiconducting devices, and dielectric materials incorporating deuterium | Patrick M. Lenahan, Niaz Mahmud | 2025-07-15 |
| 11865498 | Membrane system to treat leachate and methods of treating leachate | Timothy G. Townsend, Ronald Bishop, David Wood | 2024-01-09 |
| 11344846 | Membrane system to treat leachate and methods of treating leachate | Timothy G. Townsend, Ronald Bishop, David Wood | 2022-05-31 |
| 10300436 | Membrane system to treat leachate and methods of treating leachate | Timothy G. Townsend, Ronald Bishop, David Wood | 2019-05-28 |
| 10052716 | Manufacture of a drum for a gas turbine engine | Oliver JONES, Jamie Sismey, Luke Freeman | 2018-08-21 |
| 9750349 | Articulated frame that supports mosquito netting over a bed | — | 2017-09-05 |
| 9540254 | Membrane system to treat leachate and methods of treating leachate | Timothy G. Townsend, Ronald Bishop, David Wood | 2017-01-10 |
| 8262802 | Method of removing deposits | Ian Murray Garry, Tomas Butler | 2012-09-11 |
| RE43008 | Orthopedic implant assembly | David J. Talaber | 2011-12-06 |
| 7820559 | Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Darren N. Dunn +7 more | 2010-10-26 |
| 7683644 | Extrusion failure monitor structures | Ronald G. Filippi | 2010-03-23 |
| 7402532 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Derren N. Dunn +7 more | 2008-07-22 |
| 7102232 | Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer | Lawrence A. Clevenger, Stefanie Chiras, Timothy J. Dalton, James J. Demarest, Derren N. Dunn +7 more | 2006-09-05 |
| 6261291 | Orthopedic implant assembly | David J. Talaber | 2001-07-17 |
| 4962294 | Method and apparatus for causing an open circuit in a conductive line | Keith F. Beckham, David Carroll Challener, Arunava Gupta, Joseph M. Harvilchuck, James M. Leas +4 more | 1990-10-09 |
| 4622205 | Electromigration lifetime increase of lead base alloys | David P. Fouts, Devandra Gupta, Paul S. Ho, Jasvir Singh Jaspal, James M. Oberschmidt +2 more | 1986-11-11 |
| 4400715 | Thin film semiconductor device and method for manufacture | Steven G. Barbee, James M. Leas, Arunachala Nagarajan | 1983-08-23 |