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Home › Interconnection structure and process module assembly and rework

Interconnection structure and process module assembly and rework

US Patent 6235996 · Granted May 22, 2001

Estimated economic value: $28,959,000 ⓘ

Assignee

IBM

Inventors

Shaji Farooq (40 patents)
Mario J. Interrante (47 patents)
Sudipta K. Ray (51 patents)
William E. Sablinski (25 patents)

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