Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Selective area heating for 3D chip stack

Selective area heating for 3D chip stack

US Patent 9105629 · Granted Aug 11, 2015

Estimated economic value: $2,160,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Remote based online product selection2025
Infrared debond damage mitigation by copper fill pattern2025
Two-layer adhesion of electronics to a surface2025
Dynamic virtual reality shopping shelf interface2025
Sintering a nanoparticle paste for semiconductor chip join2025
Upgrading operating software (“OS”) for devices in a multi-device ecosystem2024
Piezoelectric device powering smart contact lens with eyelid movement2024
Cognitive rotatable item storage with automated replenishment2024
High density interconnection and wiring layers, package structures, and integrat2024
Multiple die assembly2024
Wearable multiplatform sensor2024
Electronic package structure with offset stacked chips and top and bottom side c2024