Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6545229 | Method for producing circuit board assemblies using surface mount components with finely spaced leads | Bao MA, Amit K. Sarkhel | 2003-04-08 |
| 6167615 | Method for producing circuit board assemblies using surface mount components with finely spaced leads | Bao MA, Amit K. Sarkhel | 2001-01-02 |
| 5785799 | Apparatus for attaching heat sinks directly to chip carrier modules using flexible epoxy | Thomas M. Culnane, Michael A. Gaynes, Hussain Shaukatullah | 1998-07-28 |
| 5744863 | Chip carrier modules with heat sinks attached by flexible-epoxy | Thomas M. Culnane, Michael A. Gaynes, Hussain Shaukatullah | 1998-04-28 |
| 5742483 | Method for producing circuit board assemblies using surface mount components with finely spaced leads | Bao MA, Amit K. Sarkhel | 1998-04-21 |
| 5672548 | Method for attaching heat sinks directly to chip carrier modules using flexible-epoxy | Thomas M. Culnane, Michael A. Gaynes, Hussain Shaukatullah | 1997-09-30 |