Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7596862 | Method of making a circuitized substrate | Frank D. Egitto, Andrew Seman | 2009-10-06 |
| 7325299 | Method of making a circuitized substrate | Frank D. Egitto, Andrew Seman | 2008-02-05 |
| 7235148 | Selectively roughening conductors for high frequency printed wiring boards | Richard A. Day, Kristen A. Stauffer | 2007-06-26 |
| 7185428 | Method of making a circuitized substrate | Frank D. Egitto, Andrew Seman | 2007-03-06 |
| 7129732 | Substrate test apparatus and method of testing substrates | — | 2006-10-31 |
| 6962642 | Treating copper surfaces for electronic applications | Anita Sargent | 2005-11-08 |
| 6931722 | Method of fabricating printed circuit board with mixed metallurgy pads | Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, John J. Konrad, Joseph Alphonse Kotylo +5 more | 2005-08-23 |
| 6822332 | Fine line circuitization | Frank D. Egitto, Andrew Seman | 2004-11-23 |
| 6672500 | Method for producing a reliable solder joint interconnection | David V. Caletka, Charles G. Woychik | 2004-01-06 |
| 6596384 | Selectively roughening conductors for high frequency printed wiring boards | Richard A. Day, Kristen A. Stauffer | 2003-07-22 |
| 6586683 | Printed circuit board with mixed metallurgy pads and method of fabrication | Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, John J. Konrad, Joseph Alphonse Kotylo +5 more | 2003-07-01 |
| 6423905 | Printed wiring board with improved plated through hole fatigue life | William L. Brodsky, John M. Lauffer, Douglas O. Powell, David J. Russell | 2002-07-23 |
| 6293455 | Method for producing a reliable BGA solder joint interconnection | David V. Caletka, Charles G. Woychik | 2001-09-25 |
| 6138893 | Method for producing a reliable BGA solder joint interconnection | David V. Caletka, Charles G. Woychik | 2000-10-31 |