KK

Kevin Knadle

IBM: 13 patents #8,581 of 70,183Top 15%
ET Endicott Interconnect Technologies: 1 patents #52 of 87Top 60%
Overall (All Time): #355,014 of 4,157,543Top 9%
14
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7596862 Method of making a circuitized substrate Frank D. Egitto, Andrew Seman 2009-10-06
7325299 Method of making a circuitized substrate Frank D. Egitto, Andrew Seman 2008-02-05
7235148 Selectively roughening conductors for high frequency printed wiring boards Richard A. Day, Kristen A. Stauffer 2007-06-26
7185428 Method of making a circuitized substrate Frank D. Egitto, Andrew Seman 2007-03-06
7129732 Substrate test apparatus and method of testing substrates 2006-10-31
6962642 Treating copper surfaces for electronic applications Anita Sargent 2005-11-08
6931722 Method of fabricating printed circuit board with mixed metallurgy pads Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, John J. Konrad, Joseph Alphonse Kotylo +5 more 2005-08-23
6822332 Fine line circuitization Frank D. Egitto, Andrew Seman 2004-11-23
6672500 Method for producing a reliable solder joint interconnection David V. Caletka, Charles G. Woychik 2004-01-06
6596384 Selectively roughening conductors for high frequency printed wiring boards Richard A. Day, Kristen A. Stauffer 2003-07-22
6586683 Printed circuit board with mixed metallurgy pads and method of fabrication Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, John J. Konrad, Joseph Alphonse Kotylo +5 more 2003-07-01
6423905 Printed wiring board with improved plated through hole fatigue life William L. Brodsky, John M. Lauffer, Douglas O. Powell, David J. Russell 2002-07-23
6293455 Method for producing a reliable BGA solder joint interconnection David V. Caletka, Charles G. Woychik 2001-09-25
6138893 Method for producing a reliable BGA solder joint interconnection David V. Caletka, Charles G. Woychik 2000-10-31