Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7378227 | Method of making a printed wiring board with conformally plated circuit traces | Raymond T. Galasco, Thomas R. Miller, Anita Sargent | 2008-05-27 |
| 6931722 | Method of fabricating printed circuit board with mixed metallurgy pads | Edward Lee Arrington, Anilkumar C. Bhatt, Kevin Knadle, John J. Konrad, Joseph Alphonse Kotylo +5 more | 2005-08-23 |
| 6843929 | Accelerated etching of chromium | Donald S. Farquhar, Elizabeth Foster, Michael Joseph Klodowski, Paul George Rickerl | 2005-01-18 |
| 6815126 | Printed wiring board with conformally plated circuit traces | Raymond T. Galasco, Thomas R. Miller, Anita Sargent | 2004-11-09 |
| 6607613 | Solder ball with chemically and mechanically enhanced surface properties | Frank D. Egitto, Luis J. Matienzo, David L. Questad, Rajinder S. Rai, Daniel C. Van Hart | 2003-08-19 |
| 6586683 | Printed circuit board with mixed metallurgy pads and method of fabrication | Edward Lee Arrington, Anilkumar C. Bhatt, Kevin Knadle, John J. Konrad, Joseph Alphonse Kotylo +5 more | 2003-07-01 |
| 6544584 | Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate | Edward Lee Arrington, John Christopher Camp, Robert Jeffrey Day, Curtis Michael Gunther, Thomas R. Miller | 2003-04-08 |
| 6335495 | Patterning a layered chrome-copper structure disposed on a dielectric substrate | Donald S. Farquhar, Elizabeth Foster, Michael Joseph Klodowski | 2002-01-01 |
| 6210547 | Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties | Frank D. Egitto, Luis J. Matienzo, David L. Questad, Rajinder S. Rai, Daniel C. Van Hart | 2001-04-03 |
| 6063481 | Process for removal of undersirable conductive material on a circuitized substrate and resultant circuitized substrate | Edward Lee Arrington, John Christopher Camp, Robert Jeffrey Day, Curtis Michael Gunther, Thomas R. Miller | 2000-05-16 |
| 6056831 | Process for chemically and mechanically enhancing solder surface properties | Frank D. Egitto, Luis J. Matienzo, David L. Questad, Rajinder S. Rai, Daniel C. Van Hart | 2000-05-02 |
| 6046500 | Method of controlling the spread of an adhesive on a circuitized organic substrate | Kenneth S. Lyjak, Donna Jean Trevitt | 2000-04-04 |
| 5910341 | Method of controlling the spread of an adhesive on a circuitized organic substrate | Kenneth S. Lyjak, Donna Jean Trevitt | 1999-06-08 |
| 5311660 | Methyl chloroform-free desmear process in additive circuitization | Warren A. Alpaugh, Anilkumar C. Bhatt, Michael J. Canestaro, Robert Jeffrey Day, John E. Larrabee | 1994-05-17 |
| 4967690 | Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means | Peter Haselbauer, Dae Young Jung, Ronald A. Kaschak, Hans-Dieter Kilthau, Roy H. Magnuson +1 more | 1990-11-06 |
| 4684545 | Electroless plating with bi-level control of dissolved oxygen | Peter Haselbauer, Dae Young Jung, Ronald A. Kaschak, Hans-Dieter Kilthau, Roy H. Magnuson +1 more | 1987-08-04 |
| 4444626 | Electrochromic printing | William E. Bernier, Francis Emmi, Paul Gendler, Robert J. Twieg | 1984-04-24 |
| 4358479 | Treatment of copper and use thereof | Michael J. Canestaro | 1982-11-09 |