Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7378227 | Method of making a printed wiring board with conformally plated circuit traces | Edmond O. Fey, Raymond T. Galasco, Thomas R. Miller | 2008-05-27 |
| 7332212 | Circuitized substrate with conductive polymer and seed material adhesion layer | Elizabeth Foster, Gregory Kevern | 2008-02-19 |
| 7063762 | Circuitized substrate and method of making same | Elizabeth Foster, Gregory Kevern | 2006-06-20 |
| 6962642 | Treating copper surfaces for electronic applications | Kevin Knadle | 2005-11-08 |
| 6852152 | Colloidal seed formulation for printed circuit board metallization | Raymond T. Galasco, Roy H. Magnuson, Voya R. Markovich, Thomas R. Miller, William E. Wilson | 2005-02-08 |
| 6815126 | Printed wiring board with conformally plated circuit traces | Edmond O. Fey, Raymond T. Galasco, Thomas R. Miller | 2004-11-09 |