Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6226187 | Integrated circuit package | David L. Questad, Anne Marie Quinn, George H. Thiel, Tien Y. Wu, Patrick Robert Zippetelli | 2001-05-01 |
| 6084299 | Integrated circuit package including a heat sink and an adhesive | David L. Questad, Anne Marie Quinn, George H. Thiel, Tien Y. Wu, Patrick Robert Zippetelli | 2000-07-04 |
| 6046500 | Method of controlling the spread of an adhesive on a circuitized organic substrate | Edmond O. Fey, Kenneth S. Lyjak | 2000-04-04 |
| 5910341 | Method of controlling the spread of an adhesive on a circuitized organic substrate | Edmond O. Fey, Kenneth S. Lyjak | 1999-06-08 |
| 4654126 | Process for determining the plating activity of an electroless plating bath | William J. Amelio, Voya R. Markovich, Carlos J. Sambucetti | 1987-03-31 |
| 4554182 | Method for conditioning a surface of a dielectric substrate for electroless plating | James R. Bupp, Gary K. Lemon, Voya R. Markovich, Carlos J. Sambucetti, Stephen L. Tisdale | 1985-11-19 |
| 4534797 | Method for providing an electroless copper plating bath in the take mode | David E. King, Voya R. Markovich, Carlos J. Sambucetti, Stephen L. Tisdale | 1985-08-13 |
| 4448804 | Method for selective electroless plating of copper onto a non-conductive substrate surface | William J. Amelio, Gary K. Lemon, Voya R. Markovich, Theodore Panasik, Carlos J. Sambucetti | 1984-05-15 |