| 6693031 |
Formation of a metallic interlocking structure |
Gerald G. Advocate, Jr., Francis J. Downes, Jr., Luis J. Matienzo, Ronald A. Kaschak, John S. Kresge |
2004-02-17 |
| 6639661 |
Technique for imaging electrical contacts |
William L. Brodsky, Lawrence P. Lehman |
2003-10-28 |
| 6607613 |
Solder ball with chemically and mechanically enhanced surface properties |
Frank D. Egitto, Edmond O. Fey, Luis J. Matienzo, David L. Questad, Rajinder S. Rai |
2003-08-19 |
| 6348737 |
Metallic interlocking structure |
Gerald G. Advocate, Jr., Francis J. Downes, Jr., Luis J. Matienzo, Ronald A. Kaschak, John S. Kresge |
2002-02-19 |
| 6210547 |
Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties |
Frank D. Egitto, Edmond O. Fey, Luis J. Matienzo, David L. Questad, Rajinder S. Rai |
2001-04-03 |
| 6056831 |
Process for chemically and mechanically enhancing solder surface properties |
Frank D. Egitto, Edmond O. Fey, Luis J. Matienzo, David L. Questad, Rajinder S. Rai |
2000-05-02 |
| 5194713 |
Removal of excimer laser debris using carbon dioxide laser |
Frank D. Egitto, Cynthia J. Moring |
1993-03-16 |
| 5176811 |
Gold plating bath additives for copper circuitization on polyimide printed circuit boards |
Leann G. Keim, Ralph S. Paonessa |
1993-01-05 |
