Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7703199 | Method to accommodate increase in volume expansion during solder reflow | David V. Caletka, Krishna Darbha, Donald W. Henderson, George H. Thiel | 2010-04-27 |
| 7086147 | Method of accommodating in volume expansion during solder reflow | David V. Caletka, Krishna Darbha, Donald W. Henderson, George H. Thiel | 2006-08-08 |
| 6686664 | Structure to accommodate increase in volume expansion during solder reflow | David V. Caletka, Krishna Darbha, Donald W. Henderson, George H. Thiel | 2004-02-03 |
| 6649833 | Negative volume expansion lead-free electrical connection | David V. Caletka, Krishna Darbha, Donald W. Henderson, George H. Thiel | 2003-11-18 |
| 6639661 | Technique for imaging electrical contacts | William L. Brodsky, Daniel C. Van Hart | 2003-10-28 |
| 6626196 | Arrangement and method for degassing small-high aspect ratio drilled holes prior to wet chemical processing | Francis J. Downes, Jr., Raymond T. Galasco, Robert D. Topa | 2003-09-30 |
| 6228246 | Removal of metal skin from a copper-Invar-copper laminate | Madhav Datta, Raymond T. Galasco, Roy H. Magnuson, Robin A. Susko, Robert D. Topa | 2001-05-08 |
| 6190530 | Anode container, electroplating system, method and plated object | William L. Brodsky, Donald W. Henderson | 2001-02-20 |
| 6179990 | Biased acid cleaning of a copper-invar-copper laminate | Raymond T. Galasco, Roy H. Magnuson, Robert D. Topa | 2001-01-30 |
| 5902495 | Method and apparatus for establishing a solder bond to a solder ball grid array | Edward Joseph Burke, Donald W. Henderson, Daniel Webster, deceased | 1999-05-11 |