Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

Method and structure for producing Z-axis interconnection assembly of printed wiring board elements

US Patent 6969436 · Granted Nov 29, 2005

Estimated economic value: $7,002,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

System for radiography imaging and method of operating such system2019
Electrostatic ink compositions, methods and print substrates2017
Tri-stable flexure mechanism2016
Optoelectronic device package, array and method of fabrication2014
Inkjet pen/printhead with shipping fluid2013
Method for improving gloss of a print2013
OLED lighting devices including electrodes with magnetic material2013
Method of printing images2013
Encapsulation structures of organic electroluminescence devices2013
Optoelectronic device array2013
Photovoltaic roof ridge cap and installation method2012
Methods, apparatus and articles of manufacture to control gloss quality2012