| 6708873 |
Apparatus and method for filling high aspect ratio via holes in electronic substrates |
Peter A. Gruber, Lubomyr T. Romankiw |
2004-03-23 |
| 6581280 |
Method for filling high aspect ratio via holes in electronic substrates |
Brian E. Curcio, Peter A. Gruber, Konstantinos I. Papathomas, Mark D. Poliks |
2003-06-24 |
| 6579149 |
Support and alignment device for enabling chemical mechanical polishing rinse and film measurements |
Richard J. Lebel, Rock Nadeau, Paul Smith, Hemantha K. Wickramasinghe, Theodore G. van Kessel |
2003-06-17 |
| 6527158 |
Method and apparatus for forming solder bumps |
Guy Paul Brouillette, Peter A. Gruber |
2003-03-04 |
| 6461136 |
Apparatus for filling high aspect ratio via holes in electronic substrates |
Peter A. Gruber, Lubomyr T. Romankiw |
2002-10-08 |
| 6452117 |
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes |
Brian E. Curcio, Peter A. Gruber, Konstantinos I. Papathomas, Mark D. Poliks |
2002-09-17 |
| 6394334 |
Method and apparatus for forming solder bumps |
Guy Paul Brouillette, Peter A. Gruber |
2002-05-28 |
| 6362557 |
Ultrasonic method and actuator for inducing motion of an object |
Peter A. Gruber, George F. Walker |
2002-03-26 |
| 6319093 |
Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement |
Richard J. Lebel, Rock Nadeau, Paul Smith, Hemantha K. Wickramasinghe, Theodore G. van Kessel |
2001-11-20 |
| 6056191 |
Method and apparatus for forming solder bumps |
Guy Paul Brouillette, Peter A. Gruber |
2000-05-02 |
