| 6579149 |
Support and alignment device for enabling chemical mechanical polishing rinse and film measurements |
Richard J. Lebel, Frederic Maurer, Paul Smith, Hemantha K. Wickramasinghe, Theodore G. van Kessel |
2003-06-17 |
| 6458020 |
Slurry recirculation in chemical mechanical polishing |
Jeffrey A. Brigante, Thomas L. Conrad, David J. Fontaine, Paul Smith, Theodore G. van Kessel |
2002-10-01 |
| 6340601 |
Method for reworking copper metallurgy in semiconductor devices |
Thomas F. Curran, Timothy C. Krywanczyk, Michael S. Lube, Matthew D. Moon, Clark D. Reynolds +6 more |
2002-01-22 |
| 6334807 |
Chemical mechanical polishing in-situ end point system |
Richard J. Lebel, Martin P. O'Boyle, Paul Smith, Theodore G. van Kessel, Hemantha K. Wickramasinghe |
2002-01-01 |
| 6319093 |
Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement |
Richard J. Lebel, Frederic Maurer, Paul Smith, Hemantha K. Wickramasinghe, Theodore G. van Kessel |
2001-11-20 |
| 6022266 |
In-situ pad conditioning process for CMP |
Timothy Scott Bullard, Richard J. Lebel, Paul Smith |
2000-02-08 |
| 5885135 |
CMP wafer carrier for preferential polishing of a wafer |
Daniel D. Desorcie, Richard J. Lebel, Charles A. McKinney, Timothy J. Rickard, Jr., Paul Smith +2 more |
1999-03-23 |
| 5874318 |
Dishing and erosion monitor structure for damascene metal processing |
Faye D. Baker, Daniel S. Brooks, Robert K. Leidy, Anne Elizabeth McGuire |
1999-02-23 |
| 5723874 |
Dishing and erosion monitor structure for damascene metal processing |
Faye D. Baker, Daniel S. Brooks, Robert K. Leidy, Anne Elizabeth McGuire |
1998-03-03 |
| 5663637 |
Rotary signal coupling for chemical mechanical polishing endpoint detection with a westech tool |
Leping Li, Steven G. Barbee, Gary R. Doyle, Arnold Halperin, Kevin L. Holland +4 more |
1997-09-02 |
