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System and method for creating and delivering handwritten greeting cards |
Tomer Alpert, Gracie Everitt, Jeffrey C Schwab, Molly McIntyre |
2023-01-24 |
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Centering substrates on a chuck |
Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson +1 more |
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| 9997385 |
Centering substrates on a chuck |
Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson +1 more |
2018-06-12 |
| 9685362 |
Apparatus and method for centering substrates on a chuck |
Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson +1 more |
2017-06-20 |
| 9576863 |
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness |
Shawn A. Adderly, Kyle Babinski, Daniel A. Delibac, David A. DeMuynck, Shawn R. Goddard +2 more |
2017-02-21 |
| 9484301 |
Controlled metal extrusion opening in semiconductor structure and method of forming |
Max G. Levy, Gary L. Milo, Anthony C. Speranza, Timothy D. Sullivan, David C. Thomas +1 more |
2016-11-01 |
| 9390969 |
Integrated circuit and interconnect, and method of fabricating same |
David A. DeMuynck, Zhong-Xiang He, Daniel R. Miga, Daniel S. Vanslette, Eric J. White |
2016-07-12 |
| 9330988 |
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness |
Shawn A. Adderly, Kyle Babinski, Daniel A. Delibac, David A. DeMuynck, Shawn R. Goddard +2 more |
2016-05-03 |
| 9275868 |
Uniform roughness on backside of a wafer |
Shawn A. Adderly, Jeffrey P. Gambino, Max L. Lifson, William J. Murphy, Timothy D. Sullivan +1 more |
2016-03-01 |
| 9087839 |
Semiconductor structures with metal lines |
Shawn A. Adderly, Daniel A. Delibac, Zhong-Xiang He, Anthony C. Speranza, Timothy D. Sullivan +2 more |
2015-07-21 |
| 9059258 |
Controlled metal extrusion opening in semiconductor structure and method of forming |
Max G. Levy, Gary L. Milo, Anthony C. Speranza, Timothy D. Sullivan, David C. Thomas +1 more |
2015-06-16 |
| 9006703 |
Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof |
Shawn A. Adderly, Brian M. Czabaj, Daniel A. Delibac, Jeffrey P. Gambino, David C. Thomas |
2015-04-14 |
| 8450168 |
Ferro-electric capacitor modules, methods of manufacture and design structures |
Jeffrey P. Gambino, William J. Murphy, James S. Nakos, Paul William Pastel, Brett A. Philips |
2013-05-28 |
| 7682945 |
Phase change element extension embedded in an electrode |
Chung H. Lam, Matthew J. Breitwisch, Roger W. Cheek, Alejandro G. Schrott |
2010-03-23 |
| 7511940 |
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask |
Douglas D. Coolbaugh, Ebenezer E. Eshun, Natalie B. Feilchenfeld, Michael L. Gautsch, Zhong-Xiang He +2 more |
2009-03-31 |
| 7382055 |
Integrated thin-film resistor with direct contact |
Eric M. Coker, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Anthony K. Stamper |
2008-06-03 |
| 7303972 |
Integrated thin-film resistor with direct contact |
Eric M. Coker, Douglas D. Coolbaugh, Ebenezer E. Eshun, Zhong-Xiang He, Anthony K. Stamper |
2007-12-04 |
| 7301752 |
Formation of metal-insulator-metal capacitor simultaneously with aluminum metal wiring level using a hardmask |
Douglas D. Coolbaugh, Ebenezer E. Eshun, Natalie B. Feilchenfeld, Michael L. Gautsch, Zhong-Xiang He +2 more |
2007-11-27 |
| 6340601 |
Method for reworking copper metallurgy in semiconductor devices |
Thomas F. Curran, Timothy C. Krywanczyk, Michael S. Lube, Rock Nadeau, Clark D. Reynolds +6 more |
2002-01-22 |
