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Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness |
Shawn A. Adderly, Kyle Babinski, David A. DeMuynck, Shawn R. Goddard, Matthew D. Moon +2 more |
2017-02-21 |
| 9330988 |
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness |
Shawn A. Adderly, Kyle Babinski, David A. DeMuynck, Shawn R. Goddard, Matthew D. Moon +2 more |
2016-05-03 |
| 9087839 |
Semiconductor structures with metal lines |
Shawn A. Adderly, Zhong-Xiang He, Matthew D. Moon, Anthony C. Speranza, Timothy D. Sullivan +2 more |
2015-07-21 |
| 9006703 |
Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof |
Shawn A. Adderly, Brian M. Czabaj, Jeffrey P. Gambino, Matthew D. Moon, David C. Thomas |
2015-04-14 |
| 8084864 |
Electromigration resistant aluminum-based metal interconnect structure |
Jonathan D. Chapple-Sokol, Zhong-Xiang He, Tom C. Lee, William J. Murphy, Timothy D. Sullivan +2 more |
2011-12-27 |
| 8003536 |
Electromigration resistant aluminum-based metal interconnect structure |
Jonathan D. Chapple-Sokol, Zhong-Xiang He, Tom C. Lee, William J. Murphy, Timothy D. Sullivan +2 more |
2011-08-23 |
