| 10607899 |
Nano deposition and ablation for the repair and fabrication of integrated circuits |
Jeffrey P. Gambino, Eric A. Joseph, Anthony C. Speranza |
2020-03-31 |
| 10224225 |
Centering substrates on a chuck |
Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon +1 more |
2019-03-05 |
| 10078183 |
Waveguide structures used in phonotics chip packaging |
Samantha D. DiStefano, Jeffrey P. Gambino, Prakash Periasamy, Donald R. Letourneau |
2018-09-18 |
| 9997385 |
Centering substrates on a chuck |
Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon +1 more |
2018-06-12 |
| 9685362 |
Apparatus and method for centering substrates on a chuck |
Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon +1 more |
2017-06-20 |
| 9583401 |
Nano deposition and ablation for the repair and fabrication of integrated circuits |
Jeffrey P. Gambino, Eric A. Joseph, Anthony C. Speranza |
2017-02-28 |
| 9576863 |
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness |
Kyle Babinski, Daniel A. Delibac, David A. DeMuynck, Shawn R. Goddard, Matthew D. Moon +2 more |
2017-02-21 |
| 9543219 |
Void monitoring device for measurement of wafer temperature variations |
Samantha D. DiStefano, Mark Esposito, Jeffrey P. Gambino, Prakash Periasamy |
2017-01-10 |
| 9508578 |
Method and apparatus for detecting foreign material on a chuck |
Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Jed H. Rankin +1 more |
2016-11-29 |
| 9330988 |
Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside roughness |
Kyle Babinski, Daniel A. Delibac, David A. DeMuynck, Shawn R. Goddard, Matthew D. Moon +2 more |
2016-05-03 |
| 9275868 |
Uniform roughness on backside of a wafer |
Jeffrey P. Gambino, Max L. Lifson, Matthew D. Moon, William J. Murphy, Timothy D. Sullivan +1 more |
2016-03-01 |
| 9201806 |
Anticipatorily loading a page of memory |
Paul Niekrewicz, Aydin Suren, Sebastian T. Ventrone |
2015-12-01 |
| 9196519 |
Achieving uniform capacitance between an electrostatic chuck and a semiconductor wafer |
Jeffrey P. Gambino, William J. Murphy, Jonathan D. Chapple-Sokol |
2015-11-24 |
| 9087839 |
Semiconductor structures with metal lines |
Daniel A. Delibac, Zhong-Xiang He, Matthew D. Moon, Anthony C. Speranza, Timothy D. Sullivan +2 more |
2015-07-21 |
| 9006703 |
Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof |
Brian M. Czabaj, Daniel A. Delibac, Jeffrey P. Gambino, Matthew D. Moon, David C. Thomas |
2015-04-14 |
