ML

Max G. Levy

IBM: 34 patents #2,873 of 70,183Top 5%
Globalfoundries: 6 patents #578 of 4,424Top 15%
SA Siemens Aktiengesellschaft: 6 patents #2,149 of 22,248Top 10%
KT Kabushiki Kaisha Toshiba: 1 patents #13,537 of 21,451Top 65%
Overall (All Time): #76,566 of 4,157,543Top 2%
41
Patents All Time

Issued Patents All Time

Showing 25 most recent of 41 patents

Patent #TitleCo-InventorsDate
10224225 Centering substrates on a chuck Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max L. Lifson, Matthew D. Moon +1 more 2019-03-05
10050115 Tapered gate oxide in LDMOS devices Brennan J. Brown, Natalie B. Feilchenfeld, Santosh Sharma, Yun Shi, Michael J. Zierak 2018-08-14
9997385 Centering substrates on a chuck Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max L. Lifson, Matthew D. Moon +1 more 2018-06-12
9893157 Structures with contact trenches and isolation trenches Natalie B. Feilchenfeld, Michael J. Zierak, BethAnn Lawrence 2018-02-13
9825119 Semiconductor device with metal extrusion formation Gary L. Milo, David C. Thomas 2017-11-21
9825120 Semiconductor device with metal extrusion formation Gary L. Milo, David C. Thomas 2017-11-21
9685362 Apparatus and method for centering substrates on a chuck Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max L. Lifson, Matthew D. Moon +1 more 2017-06-20
9595579 Dual shallow trench isolation (STI) structure for field effect transistor (FET) Natalie B. Feilchenfeld, Richard A. Phelps, Santosh Sharma, Yun Shi, Michael J. Zierak 2017-03-14
9548349 Semiconductor device with metal extrusion formation Gary L. Milo, David C. Thomas 2017-01-17
9508578 Method and apparatus for detecting foreign material on a chuck Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max L. Lifson, Jed H. Rankin +1 more 2016-11-29
9484301 Controlled metal extrusion opening in semiconductor structure and method of forming Gary L. Milo, Matthew D. Moon, Anthony C. Speranza, Timothy D. Sullivan, David C. Thomas +1 more 2016-11-01
9337310 Low leakage, high frequency devices Theodore Letavic, Santosh Sharma, Yun Shi 2016-05-10
9059258 Controlled metal extrusion opening in semiconductor structure and method of forming Gary L. Milo, Matthew D. Moon, Anthony C. Speranza, Timothy D. Sullivan, David C. Thomas +1 more 2015-06-16
8709903 Silicon-on-insulator (SOI) structure configured for reduced harmonics and method of forming the structure Alan B. Botula, John J. Ellis-Monaghan, Alvin J. Joseph, Richard A. Phelps, James A. Slinkman +1 more 2014-04-29
8698244 Silicon-on-insulator (SOI) structure configured for reduced harmonics, design structure and method Alan B. Botula, John J. Ellis-Monaghan, Alvin J. Joseph, Richard A. Phelps, James A. Slinkman +1 more 2014-04-15
8564067 Silicon-on-insulator (SOI) structure configured for reduced harmonics and method of forming the structure Alan B. Botula, John J. Ellis-Monaghan, Alvin J. Joseph, Richard A. Phelps, James A. Slinkman +1 more 2013-10-22
8487379 Structure and method for buried inductors for ultra-high resistivity wafers for SOI/RF SiGe applications Steven H. Voldman 2013-07-16
8471340 Silicon-on-insulator (SOI) structure configured for reduced harmonics and method of forming the structure Alan B. Botula, John J. Ellis-Monaghan, Alvin J. Joseph, Richard A. Phelps, James A. Slinkman +1 more 2013-06-25
8227318 Integration of multiple gate oxides with shallow trench isolation methods to minimize divot formation Natalie B. Feilchenfeld, Richard A. Phelps, BethAnn Rainey, James A. Slinkman, Steven H. Voldman +7 more 2012-07-24
8188570 Structure and method for buried inductors for ultra-high resistivity wafers for SOI/RF SiGe applications Steven H. Voldman 2012-05-29
7939896 SOI substrate contact with extended silicide area Dinh Dang, Thai Doan, Jessica A. Levy, Alan Frederick Norris, James A. Slinkman 2011-05-10
7883990 High resistivity SOI base wafer using thermally annealed substrate Dale W. Martin, Gerd Pfeiffer, James A. Slinkman 2011-02-08
7842580 Structure and method for buried inductors for ultra-high resistivity wafers for SOI/RF SiGe applications Steven H. Voldman 2010-11-30
7772083 Trench forming method and structure Alan B. Botula, Michael L. Gautsch, Alvin J. Joseph, James A. Slinkman 2010-08-10
7675121 SOI substrate contact with extended silicide area Dinh Dang, Thai Doan, Jessica A. Levy, Alan Frederick Norris, James A. Slinkman 2010-03-09