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Method of forming a metal silicide transparent conductive electrode |
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Method of forming a metal silicide transparent conductive electrode |
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Method of forming a metal silicide transparent conductive electrode |
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Wafer frontside-backside through silicon via |
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Method of eliminating poor reveal of through silicon vias |
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2016-09-13 |
| 9406562 |
Integrated circuit and design structure having reduced through silicon via-induced stress |
Jeffrey P. Bonn, Brent A. Goplen, Brian L. Kinsman, Robert M. Rassel, Edmund J. Sprogis |
2016-08-02 |
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Integrated circuit and interconnect, and method of fabricating same |
David A. DeMuynck, Zhong-Xiang He, Daniel R. Miga, Matthew D. Moon, Eric J. White |
2016-07-12 |
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Structure with a metal silicide transparent conductive electrode and a method of forming the structure |
Jeffrey P. Gambino, Derrick Liu |
2016-04-12 |
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Through silicon via wafer, contacts and design structures |
Jeffrey P. Gambino, Cameron E. Luce, Bucknell C. Webb |
2016-01-26 |
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Through silicon via wafer and methods of manufacturing |
Jeffrey P. Gambino, Jessica A. Levy, Cameron E. Luce, Bucknell C. Webb |
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Methods for controlling wafer curvature |
Mohammed Fazil Fayaz, Jeffery B. Maxson, Anthony K. Stamper |
2014-12-30 |
| 8809998 |
Semiconductor device including in wafer inductors, related method and design structure |
Renata Camillo-Castillo, John J. Ellis-Monaghan, Robert M. Rassel |
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Through silicon via wafer, contacts and design structures |
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Methods and structures for controlling wafer curvature |
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Integrated structures of high performance active devices and passive devices |
Robert M. Rassel, Anthony K. Stamper |
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| 8188591 |
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Robert M. Rassel, Anthony K. Stamper |
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Electromigration resistant aluminum-based metal interconnect structure |
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Simultaneously formed isolation trench and through-box contact for silicon-on-insulator technology |
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Electromigration resistant aluminum-based metal interconnect structure |
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Jonanthan D. Chapple-Sokol, Randy W. Mann, William J. Murphy, Jed H. Rankin |
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| 6838364 |
Sputtered tungsten diffusion barrier for improved interconnect robustness |
Stephen Bruce Brodsky, William J. Murphy, Matthew J. Rutten, David C. Strippe |
2005-01-04 |
| 6762121 |
Method of forming refractory metal contact in an opening, and resulting structure |
Jonathan D. Chapple-Sokol, Randy W. Mann, William J. Murphy, Jed H. Rankin |
2004-07-13 |
| 6245668 |
Sputtered tungsten diffusion barrier for improved interconnect robustness |
Stephen Bruce Brodsky, William J. Murphy, Matthew J. Rutten, David C. Strippe |
2001-06-12 |
