Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11195969 | Method of forming a metal silicide transparent conductive electrode | Jeffrey P. Gambino, Derrick Liu | 2021-12-07 |
| 11056610 | Method of forming a metal silicide transparent conductive electrode | Jeffrey P. Gambino, Derrick Liu | 2021-07-06 |
| 10147839 | Method of forming a metal silicide transparent conductive electrode | Jeffrey P. Gambino, Derrick Liu | 2018-12-04 |
| 9455214 | Wafer frontside-backside through silicon via | Jeffrey C. Maling, Anthony K. Stamper, Zeljka Topic-Beganovic | 2016-09-27 |
| 9443764 | Method of eliminating poor reveal of through silicon vias | Jeffrey C. Maling, Anthony K. Stamper, Zeljka Topic-Beganovic | 2016-09-13 |
| 9406562 | Integrated circuit and design structure having reduced through silicon via-induced stress | Jeffrey P. Bonn, Brent A. Goplen, Brian L. Kinsman, Robert M. Rassel, Edmund J. Sprogis | 2016-08-02 |
| 9390969 | Integrated circuit and interconnect, and method of fabricating same | David A. DeMuynck, Zhong-Xiang He, Daniel R. Miga, Matthew D. Moon, Eric J. White | 2016-07-12 |
| 9312426 | Structure with a metal silicide transparent conductive electrode and a method of forming the structure | Jeffrey P. Gambino, Derrick Liu | 2016-04-12 |
| 9245850 | Through silicon via wafer, contacts and design structures | Jeffrey P. Gambino, Cameron E. Luce, Bucknell C. Webb | 2016-01-26 |
| 9041210 | Through silicon via wafer and methods of manufacturing | Jeffrey P. Gambino, Jessica A. Levy, Cameron E. Luce, Bucknell C. Webb | 2015-05-26 |
| 8918988 | Methods for controlling wafer curvature | Mohammed Fazil Fayaz, Jeffery B. Maxson, Anthony K. Stamper | 2014-12-30 |
| 8809998 | Semiconductor device including in wafer inductors, related method and design structure | Renata Camillo-Castillo, John J. Ellis-Monaghan, Robert M. Rassel | 2014-08-19 |
| 8791016 | Through silicon via wafer, contacts and design structures | Jeffrey P. Gambino, Cameron E. Luce, Bucknell C. Webb | 2014-07-29 |
| 8299615 | Methods and structures for controlling wafer curvature | Mohammed Fazil Fayaz, Jeffery B. Maxson, Anthony K. Stamper | 2012-10-30 |
| 8232139 | Integrated structures of high performance active devices and passive devices | Robert M. Rassel, Anthony K. Stamper | 2012-07-31 |
| 8188591 | Integrated structures of high performance active devices and passive devices | Robert M. Rassel, Anthony K. Stamper | 2012-05-29 |
| 8084864 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more | 2011-12-27 |
| 8021943 | Simultaneously formed isolation trench and through-box contact for silicon-on-insulator technology | Alan B. Botula, BethAnn Rainey | 2011-09-20 |
| 8003536 | Electromigration resistant aluminum-based metal interconnect structure | Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more | 2011-08-23 |
| 6900505 | Method of forming refractory metal contact in an opening, and resulting structure | Jonanthan D. Chapple-Sokol, Randy W. Mann, William J. Murphy, Jed H. Rankin | 2005-05-31 |
| 6838364 | Sputtered tungsten diffusion barrier for improved interconnect robustness | Stephen Bruce Brodsky, William J. Murphy, Matthew J. Rutten, David C. Strippe | 2005-01-04 |
| 6762121 | Method of forming refractory metal contact in an opening, and resulting structure | Jonathan D. Chapple-Sokol, Randy W. Mann, William J. Murphy, Jed H. Rankin | 2004-07-13 |
| 6245668 | Sputtered tungsten diffusion barrier for improved interconnect robustness | Stephen Bruce Brodsky, William J. Murphy, Matthew J. Rutten, David C. Strippe | 2001-06-12 |