| 11195969 |
Method of forming a metal silicide transparent conductive electrode |
Jeffrey P. Gambino, Derrick Liu |
2021-12-07 |
$3,115,000 |
| 11056610 |
Method of forming a metal silicide transparent conductive electrode |
Jeffrey P. Gambino, Derrick Liu |
2021-07-06 |
$5,313,000 |
| 10147839 |
Method of forming a metal silicide transparent conductive electrode |
Jeffrey P. Gambino, Derrick Liu |
2018-12-04 |
$4,080,000 |
| 9455214 |
Wafer frontside-backside through silicon via |
Jeffrey C. Maling, Anthony K. Stamper, Zeljka Topic-Beganovic |
2016-09-27 |
$3,712,000 |
| 9443764 |
Method of eliminating poor reveal of through silicon vias |
Jeffrey C. Maling, Anthony K. Stamper, Zeljka Topic-Beganovic |
2016-09-13 |
$3,651,000 |
| 9406562 |
Integrated circuit and design structure having reduced through silicon via-induced stress |
Jeffrey P. Bonn, Brent A. Goplen, Brian L. Kinsman, Robert M. Rassel, Edmund J. Sprogis |
2016-08-02 |
$3,259,000 |
| 9390969 |
Integrated circuit and interconnect, and method of fabricating same |
David A. DeMuynck, Zhong-Xiang He, Daniel R. Miga, Matthew D. Moon, Eric J. White |
2016-07-12 |
$2,207,000 |
| 9312426 |
Structure with a metal silicide transparent conductive electrode and a method of forming the structure |
Jeffrey P. Gambino, Derrick Liu |
2016-04-12 |
$2,843,000 |
| 9245850 |
Through silicon via wafer, contacts and design structures |
Jeffrey P. Gambino, Cameron E. Luce, Bucknell C. Webb |
2016-01-26 |
$652,000 |
| 9041210 |
Through silicon via wafer and methods of manufacturing |
Jeffrey P. Gambino, Jessica A. Levy, Cameron E. Luce, Bucknell C. Webb |
2015-05-26 |
$2,909,000 |
| 8918988 |
Methods for controlling wafer curvature |
Mohammed Fazil Fayaz, Jeffery B. Maxson, Anthony K. Stamper |
2014-12-30 |
$7,309,000 |
| 8809998 |
Semiconductor device including in wafer inductors, related method and design structure |
Renata Camillo-Castillo, John J. Ellis-Monaghan, Robert M. Rassel |
2014-08-19 |
$3,895,000 |
| 8791016 |
Through silicon via wafer, contacts and design structures |
Jeffrey P. Gambino, Cameron E. Luce, Bucknell C. Webb |
2014-07-29 |
$5,690,000 |
| 8299615 |
Methods and structures for controlling wafer curvature |
Mohammed Fazil Fayaz, Jeffery B. Maxson, Anthony K. Stamper |
2012-10-30 |
|
| 8232139 |
Integrated structures of high performance active devices and passive devices |
Robert M. Rassel, Anthony K. Stamper |
2012-07-31 |
$5,473,000 |
| 8188591 |
Integrated structures of high performance active devices and passive devices |
Robert M. Rassel, Anthony K. Stamper |
2012-05-29 |
$10,419,000 |
| 8084864 |
Electromigration resistant aluminum-based metal interconnect structure |
Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more |
2011-12-27 |
$5,499,000 |
| 8021943 |
Simultaneously formed isolation trench and through-box contact for silicon-on-insulator technology |
Alan B. Botula, BethAnn Rainey |
2011-09-20 |
$5,575,000 |
| 8003536 |
Electromigration resistant aluminum-based metal interconnect structure |
Jonathan D. Chapple-Sokol, Daniel A. Delibac, Zhong-Xiang He, Tom C. Lee, William J. Murphy +2 more |
2011-08-23 |
$4,386,000 |
| 6900505 |
Method of forming refractory metal contact in an opening, and resulting structure |
Jonanthan D. Chapple-Sokol, Randy W. Mann, William J. Murphy, Jed H. Rankin |
2005-05-31 |
$8,494,000 |
| 6838364 |
Sputtered tungsten diffusion barrier for improved interconnect robustness |
Stephen Bruce Brodsky, William J. Murphy, Matthew J. Rutten, David C. Strippe |
2005-01-04 |
$10,543,000 |
| 6762121 |
Method of forming refractory metal contact in an opening, and resulting structure |
Jonathan D. Chapple-Sokol, Randy W. Mann, William J. Murphy, Jed H. Rankin |
2004-07-13 |
$8,966,000 |
| 6245668 |
Sputtered tungsten diffusion barrier for improved interconnect robustness |
Stephen Bruce Brodsky, William J. Murphy, Matthew J. Rutten, David C. Strippe |
2001-06-12 |
$30,235,000 |
