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Home › Sputtered tungsten diffusion barrier for improved interconnect robustness

Sputtered tungsten diffusion barrier for improved interconnect robustness

US Patent 6838364 · Granted Jan 4, 2005

Estimated economic value: $10,543,000 ⓘ

Assignee

IBM

Inventors

Stephen Bruce Brodsky (13 patents)
William J. Murphy (58 patents)
Matthew J. Rutten (23 patents)
David C. Strippe (12 patents)
Daniel S. Vanslette (23 patents)

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