David C. Strippe has been granted 12 US patents while listed as an inventor at IBM . The first was granted in 1988 and the most recent in March 2015. David C. Strippe ranks #396,045 of 4,157,543 US inventors in our database (top 9.5%). Patent records list David C. Strippe in Waterbury Center, VT, US.
Patents per Year Patents granted per year, 1988 to 2015 Bar chart with a peak of 2 patents in 2001. peak 2 1988: 1 patents 1988 1989: 1 patents 1995: 1 patents 1995 1996: 1 patents 1997: 1 patents 1997 2001: 2 patents 2005: 1 patents 2005 2009: 1 patents 2011: 1 patents 2011 2012: 1 patents 2015: 1 patents 2015
Issued Patents All Time
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Showing 1–12 of 12 patents
Patent # Title Co-Inventors Date Approx Value ⓘ
8969195 Methods of manufacturing semiconductor devices and a semiconductor structure Felix P. Anderson , Steven P. Barkyoumb , Edward C. Cooney, III , Thomas L. McDevitt , William J. Murphy 2015-03-03
$3,627,000
8157970 Sputtering target fixture William J. Murphy 2012-04-17
$5,847,000
8052799 By-product collecting processes for cleaning processes Edward C. Cooney, III , William J. Murphy , Anthony K. Stamper 2011-11-08
$3,097,000
7485210 Sputtering target fixture William J. Murphy 2009-02-03
$3,057,000
6838364 Sputtered tungsten diffusion barrier for improved interconnect robustness Stephen Bruce Brodsky , William J. Murphy , Matthew J. Rutten , Daniel S. Vanslette 2005-01-04
$10,543,000
6245668 Sputtered tungsten diffusion barrier for improved interconnect robustness Stephen Bruce Brodsky , William J. Murphy , Matthew J. Rutten , Daniel S. Vanslette 2001-06-12
$30,235,000
6210541 Process and apparatus for cold copper deposition to enhance copper plating fill Edward C. Cooney, III , Josef W. Korejwa 2001-04-03
$36,356,000
5628889 High power capacity magnetron cathode David L. Gardell 1997-05-13
$10,594,000
5529670 Method of depositing conductors in high aspect ratio apertures under high temperature conditions James G. Ryan , Bernd Vollmer 1996-06-25
$5,688,000
5401675 Method of depositing conductors in high aspect ratio apertures using a collimator Pei-Ing Lee , Thomas J. Licata , Thomas L. McDevitt , Paul C. Parries , Scott L. Pennington +1 more 1995-03-28
4876114 Process for the self fractionation deposition of a metallic layer on a workpiece Richard R. Phinney 1989-10-24
$23,575,000
4791261 Crucible for evaporation of metallic film Richard R. Phinney 1988-12-13
$20,757,000
