| 8969195 |
Methods of manufacturing semiconductor devices and a semiconductor structure |
Felix P. Anderson, Steven P. Barkyoumb, Edward C. Cooney, III, Thomas L. McDevitt, William J. Murphy |
2015-03-03 |
| 8157970 |
Sputtering target fixture |
William J. Murphy |
2012-04-17 |
| 8052799 |
By-product collecting processes for cleaning processes |
Edward C. Cooney, III, William J. Murphy, Anthony K. Stamper |
2011-11-08 |
| 7485210 |
Sputtering target fixture |
William J. Murphy |
2009-02-03 |
| 6838364 |
Sputtered tungsten diffusion barrier for improved interconnect robustness |
Stephen Bruce Brodsky, William J. Murphy, Matthew J. Rutten, Daniel S. Vanslette |
2005-01-04 |
| 6245668 |
Sputtered tungsten diffusion barrier for improved interconnect robustness |
Stephen Bruce Brodsky, William J. Murphy, Matthew J. Rutten, Daniel S. Vanslette |
2001-06-12 |
| 6210541 |
Process and apparatus for cold copper deposition to enhance copper plating fill |
Edward C. Cooney, III, Josef W. Korejwa |
2001-04-03 |
| 5628889 |
High power capacity magnetron cathode |
David L. Gardell |
1997-05-13 |
| 5529670 |
Method of depositing conductors in high aspect ratio apertures under high temperature conditions |
James G. Ryan, Bernd Vollmer |
1996-06-25 |
| 5401675 |
Method of depositing conductors in high aspect ratio apertures using a collimator |
Pei-Ing Lee, Thomas J. Licata, Thomas L. McDevitt, Paul C. Parries, Scott L. Pennington +1 more |
1995-03-28 |
| 4876114 |
Process for the self fractionation deposition of a metallic layer on a workpiece |
Richard R. Phinney |
1989-10-24 |
| 4791261 |
Crucible for evaporation of metallic film |
Richard R. Phinney |
1988-12-13 |
