Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8969195 | Methods of manufacturing semiconductor devices and a semiconductor structure | Felix P. Anderson, Steven P. Barkyoumb, Edward C. Cooney, III, Thomas L. McDevitt, William J. Murphy | 2015-03-03 |
| 8157970 | Sputtering target fixture | William J. Murphy | 2012-04-17 |
| 8052799 | By-product collecting processes for cleaning processes | Edward C. Cooney, III, William J. Murphy, Anthony K. Stamper | 2011-11-08 |
| 7485210 | Sputtering target fixture | William J. Murphy | 2009-02-03 |
| 6838364 | Sputtered tungsten diffusion barrier for improved interconnect robustness | Stephen Bruce Brodsky, William J. Murphy, Matthew J. Rutten, Daniel S. Vanslette | 2005-01-04 |
| 6245668 | Sputtered tungsten diffusion barrier for improved interconnect robustness | Stephen Bruce Brodsky, William J. Murphy, Matthew J. Rutten, Daniel S. Vanslette | 2001-06-12 |
| 6210541 | Process and apparatus for cold copper deposition to enhance copper plating fill | Edward C. Cooney, III, Josef W. Korejwa | 2001-04-03 |
| 5628889 | High power capacity magnetron cathode | David L. Gardell | 1997-05-13 |
| 5529670 | Method of depositing conductors in high aspect ratio apertures under high temperature conditions | James G. Ryan, Bernd Vollmer | 1996-06-25 |
| 5401675 | Method of depositing conductors in high aspect ratio apertures using a collimator | Pei-Ing Lee, Thomas J. Licata, Thomas L. McDevitt, Paul C. Parries, Scott L. Pennington +1 more | 1995-03-28 |
| 4876114 | Process for the self fractionation deposition of a metallic layer on a workpiece | Richard R. Phinney | 1989-10-24 |
| 4791261 | Crucible for evaporation of metallic film | Richard R. Phinney | 1988-12-13 |