Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6838364 | Sputtered tungsten diffusion barrier for improved interconnect robustness | Stephen Bruce Brodsky, William J. Murphy, David C. Strippe, Daniel S. Vanslette | 2005-01-04 |
| 6503827 | Method of reducing planarization defects | Susan G. Bombardier, Paul M. Feeney, Robert M. Geffken, David V. Horak | 2003-01-07 |
| 6495917 | Method and structure of column interconnect | John J. Ellis-Monaghan, Paul M. Feeney, Robert M. Geffken, Howard S. Landis, Rosemary A. Previti-Kelly +3 more | 2002-12-17 |
| 6245668 | Sputtered tungsten diffusion barrier for improved interconnect robustness | Stephen Bruce Brodsky, William J. Murphy, David C. Strippe, Daniel S. Vanslette | 2001-06-12 |
| 6171436 | Apparatus for removing slurry particles | Cuc K. Huynh, Harold G. Linde, Patricia E. Marmillion, Anthony M. Palagonia, Bernadette Ann Pierson | 2001-01-09 |
| 6110832 | Method and apparatus for slurry polishing | Clifford Owen Morgan, III, Erick G. Walton, Terrance M. Wright | 2000-08-29 |
| 6071803 | Electrical contact to buried SOI structures | Steven H. Voldman | 2000-06-06 |
| 6008083 | Precision analog metal-metal capacitor | Terry J. Brabazon, Badih El-Kareh, Stuart R. Martin, Carter W. Kaanta | 1999-12-28 |
| 5928062 | Vertical polishing device and method | Matthew Miller, Terrance M. Wright | 1999-07-27 |
| 5913713 | CMP polishing pad backside modifications for advantageous polishing results | Roger W. Cheek, John Cronin, Douglas P. Nadeau, Terrance M. Wright | 1999-06-22 |
| 5896870 | Method of removing slurry particles | Cuc K. Huynh, Harold G. Linde, Patricia E. Marmillion, Anthony M. Palagonia, Bernadette Ann Pierson | 1999-04-27 |
| 5889293 | Electrical contact to buried SOI structures | Steven H. Voldman | 1999-03-30 |
| 5877589 | Gas discharge devices including matrix materials with ionizable gas filled sealed cavities | Clifford Owen Morgan, III, Erick G. Walton, Terrance M. Wright | 1999-03-02 |
| 5876266 | Polishing pad with controlled release of desired micro-encapsulated polishing agents | Matthew Miller, Clifford Owen Morgan, III, Erick G. Walton, Terrance M. Wright | 1999-03-02 |
| 5722879 | Variable travel carrier device and method for planarizing semiconductor wafers | John Cronin | 1998-03-03 |
| 5708559 | Precision analog metal-metal capacitor | Terry J. Brabazon, Badih El-Kareh, Stuart R. Martin, Carter W. Kaanta | 1998-01-13 |
| 5704987 | Process for removing residue from a semiconductor wafer after chemical-mechanical polishing | Cuc K. Huynh, Susan L. Cohen, Douglas P. Nadeau, Robert A. Jurjevic, James Albert Gilhooly | 1998-01-06 |
| 5676587 | Selective polish process for titanium, titanium nitride, tantalum and tantalum nitride | William Francis Landers, Thomas R. Fisher, Jr., Dean Allen Schaffer | 1997-10-14 |
| 5585674 | Transverse diffusion barrier interconnect structure | Robert M. Geffken | 1996-12-17 |
| 5549511 | Variable travel carrier device and method for planarizing semiconductor wafers | John Cronin | 1996-08-27 |
| 5530262 | Bidirectional field emission devices, storage structures and fabrication methods | John Cronin, Kent E. Morrett, Michael D. Potter | 1996-06-25 |
| 5488013 | Method of forming transverse diffusion barrier interconnect structure | Robert M. Geffken | 1996-01-30 |
| 5312777 | Fabrication methods for bidirectional field emission devices and storage structures | John Cronin, Kent E. Morrett, Michael D. Potter | 1994-05-17 |