Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6730605 | Redistribution of copper deposited films | Chantal Arena-Foster, Robert F. Foster, Joseph T. Hillman, Tugrul Yasar | 2004-05-04 |
| 6508919 | Optimized liners for dual damascene metal wiring | Joseph T. Hillman | 2003-01-21 |
| 6395095 | Process apparatus and method for improved plasma processing of a substrate | William Jones, Robert Rowan, Edward L. Sill | 2002-05-28 |
| 6224724 | Physical vapor processing of a surface with non-uniformity compensation | Steven Hurwitt | 2001-05-01 |
| 6214720 | Plasma process enhancement through reduction of gaseous contaminants | Edward L. Sill | 2001-04-10 |
| 6200894 | Method for enhancing aluminum interconnect properties | Katsuya Okumura, Kenneth P. Rodbell | 2001-03-13 |
| 6197165 | Method and apparatus for ionized physical vapor deposition | John Drewery | 2001-03-06 |
| 6132564 | In-situ pre-metallization clean and metallization of semiconductor wafers | — | 2000-10-17 |
| 6117279 | Method and apparatus for increasing the metal ion fraction in ionized physical vapor deposition | Jason Smolanoff, Doug Caldwell, Jim Zibrida, Bruce Gittleman | 2000-09-12 |
| 6110824 | Wire shape conferring reduced crosstalk and formation methods | Jack A. Mandelman | 2000-08-29 |
| 6080287 | Method and apparatus for ionized physical vapor deposition | John Drewery | 2000-06-27 |
| 5885425 | Method for selective material deposition on one side of raised or recessed features | Julian Hsieh, Donald M. Kenney, James G. Ryan | 1999-03-23 |
| 5874201 | Dual damascene process having tapered vias | Ronald W. Nunes, Motoya Okazaki | 1999-02-23 |
| 5800688 | Apparatus for ionized sputtering | Alexander D. Lantsman | 1998-09-01 |
| 5796166 | Tasin oxygen diffusion barrier in multilayer structures | Paul D. Agnello, Cyril Cabral, Jr., Alfred Grill, Christopher V. Jahnes, Ronnen Andrew Roy | 1998-08-18 |
| 5776823 | Tasin oxygen diffusion barrier in multilayer structures | Paul D. Agnello, Cyril Cabral, Jr., Alfred Grill, Christopher V. Jahnes, Ronnen Andrew Roy | 1998-07-07 |
| 5766968 | Micro mask comprising agglomerated material | Michael D. Armacost, A. Richard Baker, Jr., Wayne S. Berry, Daniel Carl, Donald McAllpine Kenney | 1998-06-16 |
| 5757879 | Tungsten absorber for x-ray mask | Rajiv V. Joshi, Kurt R. Kimmel, James G. Ryan | 1998-05-26 |
| 5726498 | Wire shape conferring reduced crosstalk and formation methods | Jack A. Mandelman | 1998-03-10 |
| 5711858 | Process for depositing a conductive thin film upon an integrated circuit substrate | Richard S. Kontra, James G. Ryan, Timothy D. Sullivan | 1998-01-27 |
| 5576579 | Tasin oxygen diffusion barrier in multilayer structures | Paul D. Agnello, Cyril Cabral, Jr., Alfred Grill, Christopher V. Jahnes, Ronnen Andrew Roy | 1996-11-19 |
| 5545590 | Conductive rie-resistant collars for studs beneath rie-defined wires | — | 1996-08-13 |
| 5466626 | Micro mask comprising agglomerated material | Michael D. Armacost, A. Richard Baker, Jr., Wayne S. Berry, Daniel Carl, Donald McAllpine Kenney | 1995-11-14 |
| 5401675 | Method of depositing conductors in high aspect ratio apertures using a collimator | Pei-Ing Lee, Thomas L. McDevitt, Paul C. Parries, Scott L. Pennington, James G. Ryan +1 more | 1995-03-28 |
| 5356837 | Method of making epitaxial cobalt silicide using a thin metal underlayer | Peter J. Geiss, Herbert L. Ho, James G. Ryan | 1994-10-18 |