Issued Patents All Time
Showing 1–25 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9354630 | Flexible laser manufacturing systems and associated methods of use and manufacture | Yefim P. Sukhman, Miesha T. Stoute, James W. Rabideau, Christian J. Risser | 2016-05-31 |
| 9155988 | Multi-stage air filtration systems and associated apparatuses and methods | Yefim P. Sukhman, Stefano J. Noto, Christian J. Risser, David John Zirbel, Jr. | 2015-10-13 |
| 8603217 | Recirculating filtration systems for material processing systems and associated methods of use and manufacture | Yefim P. Sukhman, Christian J. Risser, Nathan Schuknecht, James W. Rabideau | 2013-12-10 |
| 7521089 | Method and apparatus for controlling the movement of CVD reaction byproduct gases to adjacent process chambers | John G. North, Steven P. Caliendo, John Hautala | 2009-04-21 |
| 7442636 | Method of inhibiting copper corrosion during supercritical CO2 cleaning | — | 2008-10-28 |
| 7307019 | Method for supercritical carbon dioxide processing of fluoro-carbon films | Kohei Kawamura, Akira Asano, Koutarou Miyatani, Bentley J. Palmer | 2007-12-11 |
| 7250374 | System and method for processing a substrate using supercritical carbon dioxide processing | Glenn W. Gale, Gunilla Jacobson, Bentley J. Palmer | 2007-07-31 |
| 6730605 | Redistribution of copper deposited films | Chantal Arena-Foster, Robert F. Foster, Thomas J. Licata, Tugrul Yasar | 2004-05-04 |
| 6635569 | Method of passivating and stabilizing a Ti-PECVD process chamber and combined Ti-PECVD/TiN-CVD processing method and apparatus | Michael S. Ameen, Gert Leusink, Michael G. Ward, Tugrul Yasar | 2003-10-21 |
| 6632737 | Method for enhancing the adhesion of a barrier layer to a dielectric | Tugrul Yasar, Richard Westhoff | 2003-10-14 |
| 6626186 | Method for stabilizing the internal surface of a PECVD process chamber | Steven P. Caliendo, Gerrit J. Leusink | 2003-09-30 |
| 6586330 | Method for depositing conformal nitrified tantalum silicide films by thermal CVD | Audunn Ludviksson | 2003-07-01 |
| 6562708 | Method for incorporating silicon into CVD metal films | Steven P. Caliendo | 2003-05-13 |
| 6548112 | Apparatus and method for delivery of precursor vapor from low vapor pressure liquid sources to a CVD chamber | Tugrul Yasar, Kenichi Kubo, Vincent Vezin, Hideaki Yamasaki, Yasuhiko Kojima +2 more | 2003-04-15 |
| 6508919 | Optimized liners for dual damascene metal wiring | Thomas J. Licata | 2003-01-21 |
| 6500761 | Method for improving the adhesion and durability of CVD tantalum and tantalum nitride modulated films by plasma treatment | Cory Wajda | 2002-12-31 |
| 6482477 | Method for pretreating dielectric layers to enhance the adhesion of CVD metal layers thereto | Richard Westhoff, Steven P. Caliendo | 2002-11-19 |
| 6471782 | Precursor deposition using ultrasonic nebulizer | Ching-Ping Fang | 2002-10-29 |
| 6455414 | Method for improving the adhesion of sputtered copper films to CVD transition metal based underlayers | Cory Wajda, Steven P. Caliendo | 2002-09-24 |
| 6409837 | Processing system and method for chemical vapor deposition of a metal layer using a liquid precursor | — | 2002-06-25 |
| 6368987 | Apparatus and method for preventing the premature mixture of reactant gases in CVD and PECVD reactions | Stanislaw Kopacz, Douglas A. Webb, Gerrit J. Leusink, Rene E. LeBlanc, Michael S. Ameen +2 more | 2002-04-09 |
| 6302057 | Apparatus and method for electrically isolating an electrode in a PECVD process chamber | Gerrit J. Leusink, Michael G. Ward, Tayler Bao, Jerry Yeh, Tugrul Yasar | 2001-10-16 |
| 6274496 | Method for single chamber processing of PECVD-Ti and CVD-TiN films for integrated contact/barrier applications in IC manufacturing | Gerrit J. Leusink, Michael G. Ward, Michael S. Ameen | 2001-08-14 |
| 6221770 | Low temperature plasma-enhanced formation of integrated circuits | Robert F. Foster | 2001-04-24 |
| 6220202 | Apparatus for producing thin films by low temperature plasma-enhanced chemical vapor deposition | Robert F. Foster, Rene E. LeBlanc | 2001-04-24 |