Issued Patents All Time
Showing 26–50 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6183564 | Buffer chamber for integrating physical and chemical vapor deposition chambers together in a processing system | Glyn Reynolds | 2001-02-06 |
| 6161500 | Apparatus and method for preventing the premature mixture of reactant gases in CVD and PECVD reactions | Stanislaw Kopacz, Douglas A. Webb, Gerrit J. Leusink, Rene E. LeBlanc, Michael S. Ameen +2 more | 2000-12-19 |
| 6143128 | Apparatus for preparing and metallizing high aspect ratio silicon semiconductor device contacts to reduce the resistivity thereof | Michael S. Ameen | 2000-11-07 |
| 6140215 | Method and apparatus for low temperature deposition of CVD and PECVD films | Robert F. Foster, Rikhit Arora | 2000-10-31 |
| 6121140 | Method of improving surface morphology and reducing resistivity of chemical vapor deposition-metal films | Chantal Arena, Ronald Thomas Bertram, JR., Emmanuel Guidotti | 2000-09-19 |
| 6093645 | Elimination of titanium nitride film deposition in tungsten plug technology using PE-CVD-TI and in-situ plasma nitridation | Michael S. Ameen, Douglas A. Webb | 2000-07-25 |
| 6090705 | Method of eliminating edge effect in chemical vapor deposition of a metal | Chantal Arena, Ronald Thomas Bertram, JR., Emmanuel Guidotti | 2000-07-18 |
| 6037252 | Method of titanium nitride contact plug formation | Michael S. Ameen, Robert F. Foster | 2000-03-14 |
| 5997649 | Stacked showerhead assembly for delivering gases and RF power to a reaction chamber | — | 1999-12-07 |
| 5989652 | Method of low temperature plasma enhanced chemical vapor deposition of tin film over titanium for use in via level applications | Michael S. Ameen | 1999-11-23 |
| 5975912 | Low temperature plasma-enhanced formation of integrated circuits | Robert F. Foster | 1999-11-02 |
| 5972790 | Method for forming salicides | Chantal Arena, Robert F. Foster, Michael S. Ameen, Jacques Faguet | 1999-10-26 |
| 5926737 | Use of TiCl.sub.4 etchback process during integrated CVD-Ti/TiN wafer processing | Michael S. Ameen, Gert Leusink | 1999-07-20 |
| 5897380 | Method for isolating a susceptor heating element from a chemical vapor deposition environment | Carl Louis White, Jon MacErnie | 1999-04-27 |
| 5866213 | Method for producing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor | Robert F. Foster, Rene E. LeBlanc | 1999-02-02 |
| 5834371 | Method and apparatus for preparing and metallizing high aspect ratio silicon semiconductor device contacts to reduce the resistivity thereof | Michael S. Ameen | 1998-11-10 |
| 5716870 | Method for producing titanium thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor | Robert F. Foster, Rene E. LeBlanc | 1998-02-10 |
| 5665640 | Method for producing titanium-containing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor | Robert F. Foster, Rene E. LeBlanc | 1997-09-09 |
| 5628829 | Method and apparatus for low temperature deposition of CVD and PECVD films | Robert F. Foster, Rikhit Arora | 1997-05-13 |
| 5610106 | Plasma enhanced chemical vapor deposition of titanium nitride using ammonia | Robert F. Foster, Rikhit Arora | 1997-03-11 |
| 5593511 | Method of nitridization of titanium thin films | Robert F. Foster | 1997-01-14 |
| 5575856 | Thermal cycle resistant seal and method of sealing for use with semiconductor wafer processing apparatus | Robert F. Foster, Brian Shekerjian | 1996-11-19 |
| 5567483 | Process for plasma enhanced anneal of titanium nitride | Robert F. Foster, Rikhit Arora | 1996-10-22 |
| 5567243 | Apparatus for producing thin films by low temperature plasma-enhanced chemical vapor deposition using a rotating susceptor reactor | Robert F. Foster, Rene E. LeBlanc | 1996-10-22 |
| 5562947 | Method and apparatus for isolating a susceptor heating element from a chemical vapor deposition environment | Carl Louis White, Jon MacErnie | 1996-10-08 |